JPS6429840U - - Google Patents

Info

Publication number
JPS6429840U
JPS6429840U JP12540187U JP12540187U JPS6429840U JP S6429840 U JPS6429840 U JP S6429840U JP 12540187 U JP12540187 U JP 12540187U JP 12540187 U JP12540187 U JP 12540187U JP S6429840 U JPS6429840 U JP S6429840U
Authority
JP
Japan
Prior art keywords
inorganic substance
plastic package
resin mixed
fibrous inorganic
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12540187U
Other languages
English (en)
Other versions
JPH0610691Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987125401U priority Critical patent/JPH0610691Y2/ja
Publication of JPS6429840U publication Critical patent/JPS6429840U/ja
Application granted granted Critical
Publication of JPH0610691Y2 publication Critical patent/JPH0610691Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例である繊維状の無機
物質を混入させた樹脂によるプラスチツクパツケ
ージの断面図であり、第２図は本考案の他の実施
例である繊維状の無機物質で織つた布状の無機物
質を樹脂中に埋込んだプラスチツクパツケージの
断面図、第３図は従来の粉末状無機物質を混入し
た樹脂によるプラスチツクパツケージの断面図で
ある。 １……リードフレーム、２……半導体チツプ、
３……金属細線、４……樹脂、５……繊維状の無
機物質、６……布状の無機物質、７……粉末状の
無機物質。

Claims (1)

    【実用新案登録請求の範囲】
  1. 繊維状の無機物質を混入した樹脂で電子部品を
    封入したことを特徴とするプラスチツクパツケー
    ジ。
JP1987125401U 1987-08-17 1987-08-17 プラスチック封止電子部品 Expired - Lifetime JPH0610691Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987125401U JPH0610691Y2 (ja) 1987-08-17 1987-08-17 プラスチック封止電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987125401U JPH0610691Y2 (ja) 1987-08-17 1987-08-17 プラスチック封止電子部品

Publications (2)

Publication Number Publication Date
JPS6429840U true JPS6429840U (ja) 1989-02-22
JPH0610691Y2 JPH0610691Y2 (ja) 1994-03-16

Family

ID=31375980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987125401U Expired - Lifetime JPH0610691Y2 (ja) 1987-08-17 1987-08-17 プラスチック封止電子部品

Country Status (1)

Country Link
JP (1) JPH0610691Y2 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877045U (ja) * 1981-11-16 1983-05-24 リコーエレメックス株式会社 半導体封止用織布含浸レジンの位置決構造
JPS58122758A (ja) * 1982-01-15 1983-07-21 Matsushita Electric Works Ltd 半導体素子封止成形用樹脂組成物
JPS60207353A (ja) * 1984-03-31 1985-10-18 Toshiba Corp 樹脂封止型半導体装置
JPS6380851U (ja) * 1986-11-14 1988-05-27

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877045U (ja) * 1981-11-16 1983-05-24 リコーエレメックス株式会社 半導体封止用織布含浸レジンの位置決構造
JPS58122758A (ja) * 1982-01-15 1983-07-21 Matsushita Electric Works Ltd 半導体素子封止成形用樹脂組成物
JPS60207353A (ja) * 1984-03-31 1985-10-18 Toshiba Corp 樹脂封止型半導体装置
JPS6380851U (ja) * 1986-11-14 1988-05-27

Also Published As

Publication number Publication date
JPH0610691Y2 (ja) 1994-03-16

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