JPS6431493A - Metallized structure of ceramics substrate - Google Patents

Metallized structure of ceramics substrate

Info

Publication number
JPS6431493A
JPS6431493A JP18827587A JP18827587A JPS6431493A JP S6431493 A JPS6431493 A JP S6431493A JP 18827587 A JP18827587 A JP 18827587A JP 18827587 A JP18827587 A JP 18827587A JP S6431493 A JPS6431493 A JP S6431493A
Authority
JP
Japan
Prior art keywords
metal
ceramics
baking
layer
ceramics substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18827587A
Other languages
Japanese (ja)
Inventor
Harufumi Bandai
Kimihide Sugo
Yukio Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP18827587A priority Critical patent/JPS6431493A/en
Publication of JPS6431493A publication Critical patent/JPS6431493A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enhance the strength of metallization and solderability by forming in succession on a ceramics substrate a baking layer of metal paste, which contains a predetermined amount of ceramics components involved in the substrate with respect to metal components involved in the same, and a metal layer. CONSTITUTION:Metallized films 2, 3 are formed on the surface of a ceramics substrate 1 with a 2MgO.2Al2O3.5SiO2 dopant. A baking layer 2 is formed by printing a paste containing about 5-15wt.% of the ceramics component of the ceramics substrate with respect to the metal component of the same on a metal paste made of metal components such as Pd, Ag, Ag-Pd, and Cd, etc., and baking the former on the latter. The metal layer 3 is formed on said baking layer 2 by printing or baking a metal paste involving neither frit nor any ceramics component on said baking layer 2 or by electroplating the former to the latter. Upon formation of a wiring pattern and a terminal part on the ceramics substrate, a wiring pattern is formed on the surface of the ceramics substrate 1 with use of the baking layer 2, and further the metal layer 3 is formed only on a portion in need of soldering, such as a terminal portion.
JP18827587A 1987-07-28 1987-07-28 Metallized structure of ceramics substrate Pending JPS6431493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18827587A JPS6431493A (en) 1987-07-28 1987-07-28 Metallized structure of ceramics substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18827587A JPS6431493A (en) 1987-07-28 1987-07-28 Metallized structure of ceramics substrate

Publications (1)

Publication Number Publication Date
JPS6431493A true JPS6431493A (en) 1989-02-01

Family

ID=16220808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18827587A Pending JPS6431493A (en) 1987-07-28 1987-07-28 Metallized structure of ceramics substrate

Country Status (1)

Country Link
JP (1) JPS6431493A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02196491A (en) * 1989-01-25 1990-08-03 Toshiba Corp Thick film circuit board
JPH08239265A (en) * 1994-12-23 1996-09-17 Korea Advanced Inst Of Sci Technol Dielectric ceramic composition, multilayer ceramic capacitor using the same, and method for producing the same
US8088495B2 (en) 2003-01-14 2012-01-03 Sharp Kabushiki Kaisha Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02196491A (en) * 1989-01-25 1990-08-03 Toshiba Corp Thick film circuit board
JPH08239265A (en) * 1994-12-23 1996-09-17 Korea Advanced Inst Of Sci Technol Dielectric ceramic composition, multilayer ceramic capacitor using the same, and method for producing the same
US8088495B2 (en) 2003-01-14 2012-01-03 Sharp Kabushiki Kaisha Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof

Similar Documents

Publication Publication Date Title
EP0245770A3 (en) Multilayer ceramic substrate with circuit patterns
AU7849787A (en) Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
EP0064872A3 (en) Ceramic wiring boards
KR900001088B1 (en) Process formininizing distortion in multilayer ceramic substrates and the intermediate unsintered green cermic substrate produced thereby
AU565068B2 (en) Process for producing multilayer ceramic circuit board with copper
CA2014947A1 (en) Process for applying conductive terminations to ceramic components
JPH05235497A (en) Copper conductive paste
GR3000272T3 (en) Use of a paste containing a noble metal in the production of browning utensils for microwave ovens
EP0247617A3 (en) Multilayer ceramic substrate with circuit patterns
CA2018208A1 (en) Method of manufacturing printed circuit boards
EP1265464A3 (en) Electronic component and method of manufacturing the same
JPS5618448A (en) Composite electronic part
JPS6465859A (en) Manufacture of circuit substrate
JPS57130443A (en) Substrate for hybrid integrated circuit
JPS6484690A (en) Printed wiring board and the production thereof
GB2104291A (en) Multilayer ceramic dielectric capacitors
JPH0797447B2 (en) Metallized composition
EP0394977A3 (en) Fireable compositions
JPS6489595A (en) Manufacture of wiring board
JPS5782485A (en) Formation of electrode
JPS6373593A (en) Manufacture of ceramic multilayer interconnection board
JPS598373Y2 (en) printed wiring board
JPS6425597A (en) Manufacture of multilayer interconnection board
JPS648601A (en) Manufacture of electrode layer of chip resistance for surface mounting
JPS56155554A (en) Manufacture of ceramic header