JPS6437876A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6437876A JPS6437876A JP62193978A JP19397887A JPS6437876A JP S6437876 A JPS6437876 A JP S6437876A JP 62193978 A JP62193978 A JP 62193978A JP 19397887 A JP19397887 A JP 19397887A JP S6437876 A JPS6437876 A JP S6437876A
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide film
- gate
- floating gate
- tunnel oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/683—Floating-gate IGFETs having only two programming levels programmed by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
Landscapes
- Non-Volatile Memory (AREA)
Abstract
PURPOSE:To increase the quantity of passing electricity resulting in the breakdown of a tunnel oxide film largely by composing a floating gate of amorphous Si when the floating gate insulated by the tunnel oxide film and all inter-layer insulating film extending over a source region and a drain region and a control gate are formed. CONSTITUTION:n<+> type source region 4 and drain region 5 surrounded by a thick field oxide film 2 are shaped to the surface layer section of a p-type Si substrate 1, and a thin gate oxide film 6 is applied onto the exposed surfaces of the regions 4 and 5 and the substrate 1. One part of the film 6 positioned onto the region 5 is removed through dry etching, and oxidized again and changed into a thin tunnel oxide film 7. A control gate 10 through a floating gate 8 and an inter-layer insulating film 9 is formed onto the film 6 including the tunnel oxide film 7, and these gates and film are surrounded by an SiO2 layer 11, but amorphous Si is used without employing polycrystalline Si as the floating gate 8 at that time. Accordingly, the state of the interface between the gate 8 and the film 7 is improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193978A JPS6437876A (en) | 1987-08-03 | 1987-08-03 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62193978A JPS6437876A (en) | 1987-08-03 | 1987-08-03 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437876A true JPS6437876A (en) | 1989-02-08 |
Family
ID=16316941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62193978A Pending JPS6437876A (en) | 1987-08-03 | 1987-08-03 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437876A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07240478A (en) * | 1994-02-23 | 1995-09-12 | Lg Semicon Co Ltd | Method for manufacturing non-volatile semiconductor memory device |
| US5532070A (en) * | 1992-06-02 | 1996-07-02 | Ibiden Co., Ltd. | Solder-precoated conductor circuit substrate and method of producing the same |
| JP2013172097A (en) * | 2012-02-22 | 2013-09-02 | Seiko Instruments Inc | Semiconductor nonvolatile memory device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182267A (en) * | 1985-02-08 | 1986-08-14 | Oki Electric Ind Co Ltd | Manufacturing method of semiconductor device |
| JPS62145872A (en) * | 1985-12-17 | 1987-06-29 | アドバンスト・マイクロ・デイバイシズ・インコ−ポレ−テツド | Improved MOS integrated circuit structure and method of construction thereof |
-
1987
- 1987-08-03 JP JP62193978A patent/JPS6437876A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61182267A (en) * | 1985-02-08 | 1986-08-14 | Oki Electric Ind Co Ltd | Manufacturing method of semiconductor device |
| JPS62145872A (en) * | 1985-12-17 | 1987-06-29 | アドバンスト・マイクロ・デイバイシズ・インコ−ポレ−テツド | Improved MOS integrated circuit structure and method of construction thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5532070A (en) * | 1992-06-02 | 1996-07-02 | Ibiden Co., Ltd. | Solder-precoated conductor circuit substrate and method of producing the same |
| JPH07240478A (en) * | 1994-02-23 | 1995-09-12 | Lg Semicon Co Ltd | Method for manufacturing non-volatile semiconductor memory device |
| JP2013172097A (en) * | 2012-02-22 | 2013-09-02 | Seiko Instruments Inc | Semiconductor nonvolatile memory device |
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