JPS6440174A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS6440174A JPS6440174A JP19381687A JP19381687A JPS6440174A JP S6440174 A JPS6440174 A JP S6440174A JP 19381687 A JP19381687 A JP 19381687A JP 19381687 A JP19381687 A JP 19381687A JP S6440174 A JPS6440174 A JP S6440174A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- solvent
- soldering
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 8
- 230000004907 flux Effects 0.000 abstract 6
- 239000002904 solvent Substances 0.000 abstract 5
- 239000000843 powder Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000010419 fine particle Substances 0.000 abstract 1
Landscapes
- Molten Solder (AREA)
Abstract
PURPOSE:To uniformly stick a solder of an optimum amt. and to save the solder consumption by using a solvent as the adhesive of a flux covered powder solder. CONSTITUTION:A solvent is coated on the soldering part of the metal member subjected to soldering, then the flux covered powder solder whose surface is covered by flux is brought into contact and stuck to the solvent coating part. This stuck part is then abutted to the soldering part of the metal of the counter part side and soldering is executed by heating it. The solvent acts the action of temporarily sticking until executing heating in order to solder the fine particle of the solder coated with the flux to the part thereof. Due to a flux layer existing on the surface of the powder solder the solder is well conformed to a solvent, the adhesive effect is good and yet the flux amt. can be uniformized over the whole soldering part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19381687A JPS6440174A (en) | 1987-08-04 | 1987-08-04 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19381687A JPS6440174A (en) | 1987-08-04 | 1987-08-04 | Soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6440174A true JPS6440174A (en) | 1989-02-10 |
Family
ID=16314235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19381687A Pending JPS6440174A (en) | 1987-08-04 | 1987-08-04 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6440174A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014135354A (en) * | 2013-01-09 | 2014-07-24 | Sony Corp | Circuit board, method of manufacturing the circuit board, and electronic component |
| JP2017119291A (en) * | 2015-12-28 | 2017-07-06 | 千住金属工業株式会社 | Flux-coated ball, solder joint, and method for producing flux-coated ball |
-
1987
- 1987-08-04 JP JP19381687A patent/JPS6440174A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014135354A (en) * | 2013-01-09 | 2014-07-24 | Sony Corp | Circuit board, method of manufacturing the circuit board, and electronic component |
| JP2017119291A (en) * | 2015-12-28 | 2017-07-06 | 千住金属工業株式会社 | Flux-coated ball, solder joint, and method for producing flux-coated ball |
| TWI615231B (en) * | 2015-12-28 | 2018-02-21 | 千住金屬工業股份有限公司 | Flux coated ball and flux coated ball manufacturing method |
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