JPS5485155A - Forming method for solder layer - Google Patents

Forming method for solder layer

Info

Publication number
JPS5485155A
JPS5485155A JP15402177A JP15402177A JPS5485155A JP S5485155 A JPS5485155 A JP S5485155A JP 15402177 A JP15402177 A JP 15402177A JP 15402177 A JP15402177 A JP 15402177A JP S5485155 A JPS5485155 A JP S5485155A
Authority
JP
Japan
Prior art keywords
layer
solder
flux
solder layer
fusing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15402177A
Other languages
Japanese (ja)
Other versions
JPS6114913B2 (en
Inventor
Shuichi Murakami
Kazuhide Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15402177A priority Critical patent/JPS5485155A/en
Publication of JPS5485155A publication Critical patent/JPS5485155A/en
Publication of JPS6114913B2 publication Critical patent/JPS6114913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To obtain the solder layer having optional thickness and to realize stable soldering, by applying flux on the face to be soldered and sticking the spherical solder having a fixed diameter by utilizing adhesive property of flux and then, fusing by heating. CONSTITUTION:The flux layer 3 is formed on the surface of the conductive layer 2, such as silver, Pd etc., coated on the insulating base board 1, such as ceramics etc., using screen process etc. The spherical solder 4 is sticked on the surface of the layer 2 by utilizing adhesive property of the above layer 3. The solder layer 5 is formed on the surface of the layer 2 by placing the board 1 on hot plate etc. and fusing the solder 4. By the above method, optional solder layer is obtained by changing the diameter of the solder 4.
JP15402177A 1977-12-20 1977-12-20 Forming method for solder layer Granted JPS5485155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15402177A JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15402177A JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Publications (2)

Publication Number Publication Date
JPS5485155A true JPS5485155A (en) 1979-07-06
JPS6114913B2 JPS6114913B2 (en) 1986-04-21

Family

ID=15575164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15402177A Granted JPS5485155A (en) 1977-12-20 1977-12-20 Forming method for solder layer

Country Status (1)

Country Link
JP (1) JPS5485155A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104397A (en) * 1986-10-08 1988-05-09 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション Method of forming solder upheaval

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1070225A (en) * 1996-08-27 1998-03-10 Nippon Steel Corp Partial plating method for electronic component substrates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho
JPS51121772A (en) * 1975-04-18 1976-10-25 Hitachi Ltd Method of soldering wiring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5193762A (en) * 1975-02-14 1976-08-17 Sogosetsuzokutaino seizohoho
JPS51121772A (en) * 1975-04-18 1976-10-25 Hitachi Ltd Method of soldering wiring

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63104397A (en) * 1986-10-08 1988-05-09 インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション Method of forming solder upheaval

Also Published As

Publication number Publication date
JPS6114913B2 (en) 1986-04-21

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