JPS6441299A - Method of mounting electronic component - Google Patents

Method of mounting electronic component

Info

Publication number
JPS6441299A
JPS6441299A JP19772687A JP19772687A JPS6441299A JP S6441299 A JPS6441299 A JP S6441299A JP 19772687 A JP19772687 A JP 19772687A JP 19772687 A JP19772687 A JP 19772687A JP S6441299 A JPS6441299 A JP S6441299A
Authority
JP
Japan
Prior art keywords
soldered
lands
resistance layer
peeled
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19772687A
Other languages
Japanese (ja)
Other versions
JPH0442838B2 (en
Inventor
Kazuhiro Shimada
Shizuo Sakurai
Yozo Obara
Sakae Shinkawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuriku Electric Industry Co Ltd
Original Assignee
Hokuriku Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuriku Electric Industry Co Ltd filed Critical Hokuriku Electric Industry Co Ltd
Priority to JP19772687A priority Critical patent/JPS6441299A/en
Publication of JPS6441299A publication Critical patent/JPS6441299A/en
Publication of JPH0442838B2 publication Critical patent/JPH0442838B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To prevent a dielectric length between lands from being short due to needless substances existing between soldered parts, by using a soldered resistance layer, which can be peeled, for prevention of bridging, to perform a soldering process and next by peeling said soldered resistance layer. CONSTITUTION:A soldered resistance layer 10, which can be peeled, for prevention of bridging is formed between lands 4 and 4 on one surface of an insulation substrate 1. Lead terminals 3, 3 are soldered with the lands 4, 4 as they are. After the finish of the soldering, said soldered resistance layer 10 is peeled and removed. Solder 9 and flux residue 8, which exist between the lands 4, 4 and cause to shorten a dielectric length therebetween, can be removed easily, and so the dielectric length between the lands can be made large.
JP19772687A 1987-08-07 1987-08-07 Method of mounting electronic component Granted JPS6441299A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19772687A JPS6441299A (en) 1987-08-07 1987-08-07 Method of mounting electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19772687A JPS6441299A (en) 1987-08-07 1987-08-07 Method of mounting electronic component

Publications (2)

Publication Number Publication Date
JPS6441299A true JPS6441299A (en) 1989-02-13
JPH0442838B2 JPH0442838B2 (en) 1992-07-14

Family

ID=16379324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19772687A Granted JPS6441299A (en) 1987-08-07 1987-08-07 Method of mounting electronic component

Country Status (1)

Country Link
JP (1) JPS6441299A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5787195A (en) * 1980-11-20 1982-05-31 Kenwood Corp Printed circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5787195A (en) * 1980-11-20 1982-05-31 Kenwood Corp Printed circuit

Also Published As

Publication number Publication date
JPH0442838B2 (en) 1992-07-14

Similar Documents

Publication Publication Date Title
CA1187678A (en) Method of bonding electronic components
ATE90830T1 (en) METHOD AND DEVICE FOR PIP SOLDERING OF CIRCUIT BOARDS.
EP0394588A3 (en) Solder terminal
CA2214130A1 (en) Assemblies of substrates and electronic components
EP0126164A4 (en) METHOD FOR CONNECTING DOUBLE-SIDED CIRCUITS.
JPS6441299A (en) Method of mounting electronic component
CA2022400A1 (en) Method for improving insulation resistance of printed circuits
JPS53147263A (en) Method of soldering wiring substrate of electronic part
JPS6484690A (en) Printed wiring board and the production thereof
JPS55122666A (en) Solder fusion-connecting method
JPS6472590A (en) Method of mounting component of aluminum conductor circuit substrate
JPS5567154A (en) Method of installing lead-less ic package
ATE34783T1 (en) PROCESSES FOR MAINTAINING SOLDERABILITY OF LEAD-TIN COATINGS; AND THRU PCB.
JPS64789A (en) Superconducting printed-circuit board
JPS5575257A (en) Substrate circuit device
JPS57141934A (en) Semiconductor device
JPS6430240A (en) Semiconductor device
JPS5552231A (en) Semiconductor attaching device
JPS6418298A (en) Printed wiring board
GB2015405A (en) Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate
JPS57180155A (en) Vessel for electronic circuit
JPS5411864A (en) Soldering method
JPS6424494A (en) Formation of solder layer on printed wiring board
JPS58221667A (en) Soldering method of chip parts
JPS6419688A (en) Method of soldering lead to printed wiring board