JPS6442830A - Wire bonding - Google Patents

Wire bonding

Info

Publication number
JPS6442830A
JPS6442830A JP62199039A JP19903987A JPS6442830A JP S6442830 A JPS6442830 A JP S6442830A JP 62199039 A JP62199039 A JP 62199039A JP 19903987 A JP19903987 A JP 19903987A JP S6442830 A JPS6442830 A JP S6442830A
Authority
JP
Japan
Prior art keywords
bonding
wedge
wire
section
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62199039A
Other languages
Japanese (ja)
Other versions
JPH054814B2 (en
Inventor
Hideaki Miyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marine Instr Co Ltd
Original Assignee
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marine Instr Co Ltd filed Critical Marine Instr Co Ltd
Priority to JP62199039A priority Critical patent/JPS6442830A/en
Publication of JPS6442830A publication Critical patent/JPS6442830A/en
Publication of JPH054814B2 publication Critical patent/JPH054814B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To allow an accurate bonding by ensuring that a predetermined length of a wire tip is pinchingly pressed between the first bonding section and a wedge tip end at the time of bonding the first bonding section. CONSTITUTION:A bonding wedge 1 is once lifted, and a wire 2 being of a length required for the first bonding is prepared by pulling out until such time as the bonding wedge 1 is moved over to the first bonding section 7 after completion of the bonding of the second bonding section 8. Then the bonding wedge 1 is lowered down frontward obliquely, and a wire 2 which is pulled out from the tip is welded by pressure to a board 6 or a member thereof so that the wire of a predetermined length can be reserved in advance by bending in the vicinity of a point just before reaching and laid along the bonding wedge tip end. Then the bonding wedge 1 is moved over to the first bonding section 7. According to the constitution, it is ensured that the first bonding can be made accurately even with a wedge whose guiding hole is sharply sloping.
JP62199039A 1987-08-11 1987-08-11 Wire bonding Granted JPS6442830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62199039A JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62199039A JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Publications (2)

Publication Number Publication Date
JPS6442830A true JPS6442830A (en) 1989-02-15
JPH054814B2 JPH054814B2 (en) 1993-01-20

Family

ID=16401103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62199039A Granted JPS6442830A (en) 1987-08-11 1987-08-11 Wire bonding

Country Status (1)

Country Link
JP (1) JPS6442830A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method
JPS5889833A (en) * 1981-11-25 1983-05-28 Shinkawa Ltd Wire bonding method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568831A (en) * 1979-06-21 1981-01-29 Shinkawa Ltd Wire bonding method
JPS5889833A (en) * 1981-11-25 1983-05-28 Shinkawa Ltd Wire bonding method

Also Published As

Publication number Publication date
JPH054814B2 (en) 1993-01-20

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