JPS568831A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS568831A
JPS568831A JP7831379A JP7831379A JPS568831A JP S568831 A JPS568831 A JP S568831A JP 7831379 A JP7831379 A JP 7831379A JP 7831379 A JP7831379 A JP 7831379A JP S568831 A JPS568831 A JP S568831A
Authority
JP
Japan
Prior art keywords
wire
tool
clamper
bonding point
horizontally
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7831379A
Other languages
Japanese (ja)
Other versions
JPS5855665B2 (en
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP54078313A priority Critical patent/JPS5855665B2/en
Publication of JPS568831A publication Critical patent/JPS568831A/en
Publication of JPS5855665B2 publication Critical patent/JPS5855665B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a preferably shaped state of a wire bonded by feeding the wire while moving it slightly upwardly, horizontally, and backwardly at a tool after bonding it at the second bonding point, and moving the wire together with a clamping tool via clamper in horizontally backward direction to cut the wire. CONSTITUTION:A wire 3 clamped by a clamper 4 is disposed at the end 3a on the first bonding point, and a tool 2 mounted at an ultrasonic oscillation horn 1 is made contacted on the end 3a. Then, the tool 2 is lowered to bring the end 3a of the wire 3 into contact with the first bonding point to bond it, the clamper 4 is then opened, and the tool 2 and the clamper 4 are diposed at the upper portion of the second bonding point. Thereafter, the tool 2 is lowered to bond the end 3a and then the wire 3 to the second bonding point, and the tool 2 is raised slightly to move it horizontally and backwardly so as to pull the wire 3. Then, the clamper 4 is closed to move the wire together with the tool 2 in the horizontally and backwardly and to cut the wire 3 in the vicinity of the bonded portion.
JP54078313A 1979-06-21 1979-06-21 wire bonding method Expired JPS5855665B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54078313A JPS5855665B2 (en) 1979-06-21 1979-06-21 wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54078313A JPS5855665B2 (en) 1979-06-21 1979-06-21 wire bonding method

Publications (2)

Publication Number Publication Date
JPS568831A true JPS568831A (en) 1981-01-29
JPS5855665B2 JPS5855665B2 (en) 1983-12-10

Family

ID=13658440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54078313A Expired JPS5855665B2 (en) 1979-06-21 1979-06-21 wire bonding method

Country Status (1)

Country Link
JP (1) JPS5855665B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897840U (en) * 1981-12-24 1983-07-02 海上電機株式会社 bonding equipment
JPS6442830A (en) * 1987-08-11 1989-02-15 Marine Instr Co Ltd Wire bonding
JPH0244743A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Wire bonding
JPH0244744A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Wire bonding
US20100279191A1 (en) * 2009-03-16 2010-11-04 Kabushiki Kaisha Toyota Jidoshokki Fuel cell system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5897840U (en) * 1981-12-24 1983-07-02 海上電機株式会社 bonding equipment
JPS6442830A (en) * 1987-08-11 1989-02-15 Marine Instr Co Ltd Wire bonding
JPH0244743A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Wire bonding
JPH0244744A (en) * 1988-08-05 1990-02-14 Marine Instr Co Ltd Wire bonding
US20100279191A1 (en) * 2009-03-16 2010-11-04 Kabushiki Kaisha Toyota Jidoshokki Fuel cell system
US8697305B2 (en) * 2009-03-16 2014-04-15 Kabushiki Kaisha Toyoda Jidoshokki Fuel cell system

Also Published As

Publication number Publication date
JPS5855665B2 (en) 1983-12-10

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