JPS6444032A - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JPS6444032A
JPS6444032A JP62200004A JP20000487A JPS6444032A JP S6444032 A JPS6444032 A JP S6444032A JP 62200004 A JP62200004 A JP 62200004A JP 20000487 A JP20000487 A JP 20000487A JP S6444032 A JPS6444032 A JP S6444032A
Authority
JP
Japan
Prior art keywords
bonding
wedge
wire
predetermined length
deltay2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62200004A
Other languages
Japanese (ja)
Other versions
JPH0465537B2 (en
Inventor
Hideaki Miyoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marine Instr Co Ltd
Original Assignee
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marine Instr Co Ltd filed Critical Marine Instr Co Ltd
Priority to JP62200004A priority Critical patent/JPS6444032A/en
Publication of JPS6444032A publication Critical patent/JPS6444032A/en
Publication of JPH0465537B2 publication Critical patent/JPH0465537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To effectively perform a first bonding by moving a bonding wedge obliquely forward down of the wedge relatively to a first bonding part to press a wire fed from its end to the first bonding part. CONSTITUTION:A wedge 1 is disposed above a position displaced rearward at DELTAy2 from a first bonding part 71. Then, when the wedge 1 is moved down obliquely like an arrow 10 while correcting DELTAy2 forward down to be correctly aligned to the part 71 and the end of a wire having a predetermined length lis interposed between the part 71 and an end face 4 in contact, the end of the wire 2 is effectively bent at the base 9 of the predetermined length l so that the wire 2 of the predetermined length l is pressed in contact with the part 71. Thus, it is bonded with ultrasonic wave as it is. Accordingly, the first bonding can be effectively performed without considerably increasing the operation of the wedge 1 and the required time of the bonding.
JP62200004A 1987-08-12 1987-08-12 Wire bonding method Granted JPS6444032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62200004A JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62200004A JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS6444032A true JPS6444032A (en) 1989-02-16
JPH0465537B2 JPH0465537B2 (en) 1992-10-20

Family

ID=16417195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62200004A Granted JPS6444032A (en) 1987-08-12 1987-08-12 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS6444032A (en)

Also Published As

Publication number Publication date
JPH0465537B2 (en) 1992-10-20

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