JPS6444657U - - Google Patents

Info

Publication number
JPS6444657U
JPS6444657U JP1987138774U JP13877487U JPS6444657U JP S6444657 U JPS6444657 U JP S6444657U JP 1987138774 U JP1987138774 U JP 1987138774U JP 13877487 U JP13877487 U JP 13877487U JP S6444657 U JPS6444657 U JP S6444657U
Authority
JP
Japan
Prior art keywords
light
diode chip
light emitting
irradiation direction
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987138774U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138774U priority Critical patent/JPS6444657U/ja
Publication of JPS6444657U publication Critical patent/JPS6444657U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ，ｂは、それぞれ本考案の実施例の正
面図と側面断面図である。第１図ｃ，ｄは、それ
ぞれ第１図ａ，ｂに示した発光装置の光出力の指
向特性の正面図と側面図である。第２図ａ，ｂは
、それぞれ本考案の別の実施例の正面図と側面断
面図である。第２図ｃ，ｄは、それぞれ第２図ａ
，ｂのに示した発光装置の光出力の指向特性の正
面図と側面図である。第３図ａ，ｂは、それぞれ
従来例の正面図と側面図である。第３図ｃ，ｄは
、それぞれ第３図ａ，ｂの従来例の光出力の指向
特性の正面図と側面図である。 １１……チツプを搭載するリード端子、１２…
…発光ダイオードチツプ、１５……発光ダイオー
ドチツプの端面発光部、１６……光出力方向、１
７，１７′……反射光方向、１８，１８′……光
反射壁、１９，１９′……光反射壁の光反射表面
。 FIGS. 1a and 1b are a front view and a side sectional view, respectively, of an embodiment of the present invention. FIGS. 1c and d are a front view and a side view of the directional characteristics of the light output of the light emitting device shown in FIGS. 1a and 1b, respectively. FIGS. 2a and 2b are a front view and a side sectional view, respectively, of another embodiment of the present invention. Figures 2c and d are Figure 2a, respectively.
,b are front and side views of the directional characteristics of the light output of the light emitting device shown in FIGS. FIGS. 3a and 3b are a front view and a side view of a conventional example, respectively. FIGS. 3c and 3d are a front view and a side view of the directional characteristics of the optical output of the conventional example shown in FIGS. 3a and 3b, respectively. 11...Lead terminal for mounting a chip, 12...
...Light emitting diode chip, 15... Edge light emitting part of light emitting diode chip, 16... Light output direction, 1
7, 17'... Direction of reflected light, 18, 18'... Light reflecting wall, 19, 19'... Light reflecting surface of the light reflecting wall.

Claims (1)

【実用新案登録請求の範囲】 (1) 端面発光型の発光ダイオードチツプの底面
を導電性ペーストを用いて、リードフレーム上に
接着して搭載し、 該発光ダイオードチツプの照射方向に面した一
部端面を発光面として利用するとともに、照射方
向に面していない残りの端面から射出される光線
を上記照射方向に反射する反射面を備えた光反射
部材を、該発光ダイオードチツプの近傍に設置す
ることを特徴とする発光装置。 (2) 光反射部材の光の反射面が凹面であること
を特徴とする実用新案登録請求の範囲第１項記載
の発光装置。[Claims for Utility Model Registration] (1) The bottom surface of an edge-emitting type light-emitting diode chip is bonded and mounted on a lead frame using conductive paste, and the part of the light-emitting diode chip facing the irradiation direction A light reflecting member that uses the end face as a light emitting surface and has a reflective surface that reflects the light rays emitted from the remaining end face not facing the irradiation direction in the irradiation direction is installed near the light emitting diode chip. A light emitting device characterized by: (2) The light emitting device according to claim 1, wherein the light reflecting surface of the light reflecting member is a concave surface.
JP1987138774U 1987-09-10 1987-09-10 Pending JPS6444657U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138774U JPS6444657U (en) 1987-09-10 1987-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138774U JPS6444657U (en) 1987-09-10 1987-09-10

Publications (1)

Publication Number Publication Date
JPS6444657U true JPS6444657U (en) 1989-03-16

Family

ID=31401427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138774U Pending JPS6444657U (en) 1987-09-10 1987-09-10

Country Status (1)

Country Link
JP (1) JPS6444657U (en)

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