JPS6444657U - - Google Patents

Info

Publication number
JPS6444657U
JPS6444657U JP1987138774U JP13877487U JPS6444657U JP S6444657 U JPS6444657 U JP S6444657U JP 1987138774 U JP1987138774 U JP 1987138774U JP 13877487 U JP13877487 U JP 13877487U JP S6444657 U JPS6444657 U JP S6444657U
Authority
JP
Japan
Prior art keywords
light
diode chip
light emitting
irradiation direction
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987138774U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987138774U priority Critical patent/JPS6444657U/ja
Publication of JPS6444657U publication Critical patent/JPS6444657U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1987138774U 1987-09-10 1987-09-10 Pending JPS6444657U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987138774U JPS6444657U (fr) 1987-09-10 1987-09-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987138774U JPS6444657U (fr) 1987-09-10 1987-09-10

Publications (1)

Publication Number Publication Date
JPS6444657U true JPS6444657U (fr) 1989-03-16

Family

ID=31401427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987138774U Pending JPS6444657U (fr) 1987-09-10 1987-09-10

Country Status (1)

Country Link
JP (1) JPS6444657U (fr)

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