JPS6450572A - Semiconductor radiation ray detection element - Google Patents
Semiconductor radiation ray detection elementInfo
- Publication number
- JPS6450572A JPS6450572A JP62208654A JP20865487A JPS6450572A JP S6450572 A JPS6450572 A JP S6450572A JP 62208654 A JP62208654 A JP 62208654A JP 20865487 A JP20865487 A JP 20865487A JP S6450572 A JPS6450572 A JP S6450572A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- metal electrode
- electrode layer
- amorphous semiconductor
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To obtain the title element having a low leak current and excellent reliability and stability by a method wherein a metal electrode layer is formed at least on a part of the region on the amorphous semiconductor layer A located on a single crystal semiconductor substrate, and an amorphous semiconductor layer B is provided covering at least the end part of the junction part of the metal electrode layer and the amor phous semiconductor layer A. CONSTITUTION:An amorphous semiconductor layer A2 covering a single crystal semicon ductor substrate 1, a metal electrode layer 3 covering at least a part of said amorphous semiconductor layer A2, and an amorphous semiconductor layer B4 at least covering the end part of the junction part of the above-mentioned metal electrode layer 3 and the above-mentioned amorphous semiconductor layer A2 are provided. For exam ple, an amorphous SiC semiconductor layer A2 of 3000Angstrom is deposited on a P-type single crystal Si substrate 1 of 5mm square, having the specific resistance of 10kOMEGAcm or thereabout, the plane direction of 111, the thickness of 500mum. The metal electrode layer 3 of 4000Angstrom is deposited thereon, and patterning is conducted in 3mm square. Besides, an amorphous SiC semiconductor layer B4 of 5000Angstrom is deposited thereon, a contact hole 5 to be used to contact a lead wire with which the metal electrode layer 3 and the external circuit are linked is performed, and a metal electrode layer 6 is formed on the rear surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62208654A JPS6450572A (en) | 1987-08-21 | 1987-08-21 | Semiconductor radiation ray detection element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62208654A JPS6450572A (en) | 1987-08-21 | 1987-08-21 | Semiconductor radiation ray detection element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6450572A true JPS6450572A (en) | 1989-02-27 |
Family
ID=16559830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62208654A Pending JPS6450572A (en) | 1987-08-21 | 1987-08-21 | Semiconductor radiation ray detection element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6450572A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0396284A (en) * | 1989-09-08 | 1991-04-22 | Fuji Electric Co Ltd | Semiconductor radiation-detecting element |
| US5070027A (en) * | 1989-02-23 | 1991-12-03 | Matsushita Electric Industrial Co., Ltd. | Method of forming a heterostructure diode |
-
1987
- 1987-08-21 JP JP62208654A patent/JPS6450572A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5070027A (en) * | 1989-02-23 | 1991-12-03 | Matsushita Electric Industrial Co., Ltd. | Method of forming a heterostructure diode |
| JPH0396284A (en) * | 1989-09-08 | 1991-04-22 | Fuji Electric Co Ltd | Semiconductor radiation-detecting element |
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