JPS6450596A - Method of soldering for surface mounting component - Google Patents

Method of soldering for surface mounting component

Info

Publication number
JPS6450596A
JPS6450596A JP62207434A JP20743487A JPS6450596A JP S6450596 A JPS6450596 A JP S6450596A JP 62207434 A JP62207434 A JP 62207434A JP 20743487 A JP20743487 A JP 20743487A JP S6450596 A JPS6450596 A JP S6450596A
Authority
JP
Japan
Prior art keywords
hole
solder
pad
soldering
mounting component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62207434A
Other languages
Japanese (ja)
Inventor
Kazuo Tomizaki
Yuichi Ideushi
Sadao Itabashi
Kiichi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62207434A priority Critical patent/JPS6450596A/en
Publication of JPS6450596A publication Critical patent/JPS6450596A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To eliminate the generation of a detective soldering even though a through hole is provided in a pad and to make it possible to execute totally a soldering work using an automatic machine by a method wherein a solder mixed with paste is coated on a through hole in the surface opposite to the pad having the through hole as well. CONSTITUTION:Solders 4 mixed with paste are each coated on pads 2 and 3 of a printed-wiring board 1 provided with a plurality of the pads 2 and 3 for mounting a surface mounting component including the pad 2 having a through hole 5, the surface mounting component 7 is placed on the solders 4 on the pads 2 and 3 and the component 7 is soldered by heating and fusing the solders 4. In such a soldering method for the surface mounting component, a solder 6 mixed with paste is coated on a through hole in the surface opposite to the above pad 2 having the through hole 5 as well. Thereby, as a fused solder 8 of the solder 6 flows in the hole 5 at the time of heating and the inflow of the solder 4 on the pad 2 into the hole 5 is almost eliminated, it is eliminated to cause the shortage of solder.
JP62207434A 1987-08-21 1987-08-21 Method of soldering for surface mounting component Pending JPS6450596A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62207434A JPS6450596A (en) 1987-08-21 1987-08-21 Method of soldering for surface mounting component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62207434A JPS6450596A (en) 1987-08-21 1987-08-21 Method of soldering for surface mounting component

Publications (1)

Publication Number Publication Date
JPS6450596A true JPS6450596A (en) 1989-02-27

Family

ID=16539702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62207434A Pending JPS6450596A (en) 1987-08-21 1987-08-21 Method of soldering for surface mounting component

Country Status (1)

Country Link
JP (1) JPS6450596A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004038964A1 (en) * 2004-08-10 2006-02-23 Endress + Hauser Gmbh + Co. Kg Printed circuit board with at least one thermally critical SMD component and method for producing, equipping and soldering a printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004038964A1 (en) * 2004-08-10 2006-02-23 Endress + Hauser Gmbh + Co. Kg Printed circuit board with at least one thermally critical SMD component and method for producing, equipping and soldering a printed circuit board

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