JPS6457798A - Shielding structure for electronic device - Google Patents

Shielding structure for electronic device

Info

Publication number
JPS6457798A
JPS6457798A JP21452787A JP21452787A JPS6457798A JP S6457798 A JPS6457798 A JP S6457798A JP 21452787 A JP21452787 A JP 21452787A JP 21452787 A JP21452787 A JP 21452787A JP S6457798 A JPS6457798 A JP S6457798A
Authority
JP
Japan
Prior art keywords
housing
partitions
dividing
thickness
predetermined circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21452787A
Other languages
Japanese (ja)
Other versions
JP2514979B2 (en
Inventor
Toshihiro Inoki
Shinichi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62214527A priority Critical patent/JP2514979B2/en
Publication of JPS6457798A publication Critical patent/JPS6457798A/en
Application granted granted Critical
Publication of JP2514979B2 publication Critical patent/JP2514979B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To reduce the thickness of an electronic device in such a manner that its housing is employed also as a shielding case by providing a partition for dividing a printed wiring board at each predetermined circuit section of the board contained in the housing, and so forming at least the inner walls of the partition and the housing as to have conductivity. CONSTITUTION:An upper shielding case 26 is formed by aluminum die casting, and partitions 27 for dividing a printed wiring board 23 in predetermined circuit sections 25 are provided. A rear side housing 22 also has partitions 29 for dividing the board 23 in predetermined circuit sections 25 to be stood on its inner wall 30 to be integrally formed with the rear housing 22. In this case, since the housing 22 is formed of resin to reduce the weight of a device, the partitions 29 and the inner walls 30 are formed, for example, with aluminum deposited film 33 on the inner surfaces. The metal deposited film satisfies its shielding performance, and can be sufficiently reduced in its thickness as compared with a metal plate. Accordingly, the practical increases in the weight and the thickness of the housing 20 are not necessarily considered.
JP62214527A 1987-08-28 1987-08-28 Electronic device shield structure Expired - Lifetime JP2514979B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62214527A JP2514979B2 (en) 1987-08-28 1987-08-28 Electronic device shield structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62214527A JP2514979B2 (en) 1987-08-28 1987-08-28 Electronic device shield structure

Publications (2)

Publication Number Publication Date
JPS6457798A true JPS6457798A (en) 1989-03-06
JP2514979B2 JP2514979B2 (en) 1996-07-10

Family

ID=16657199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62214527A Expired - Lifetime JP2514979B2 (en) 1987-08-28 1987-08-28 Electronic device shield structure

Country Status (1)

Country Link
JP (1) JP2514979B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077283A (en) * 1992-09-01 1995-01-10 Tokyo Ingusu Kk Electromagnetic wave-shielded plastic molding
JPH0936581A (en) * 1995-07-25 1997-02-07 Toshiba Corp Shielding case and electronic equipment
EP0820218A1 (en) * 1996-07-20 1998-01-21 Siegfried Schaal Metallveredelung GmbH & Co. Electronic device and shielding cap for an electronic device
FR2798553A1 (en) * 1999-09-14 2001-03-16 Sagem PROTECTION DEVICE FOR ELECTRONIC COMPONENTS
US7541986B2 (en) 2003-07-23 2009-06-02 Lg Electronics Inc. Internal antenna and mobile terminal having the internal antenna
JP2012159935A (en) * 2011-01-31 2012-08-23 Murata Mfg Co Ltd Electronic component module, method for manufacturing electronic component module, and multifunctional card

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043253U (en) * 1973-08-17 1975-05-01
JPS5984865U (en) * 1983-09-01 1984-06-08 富士通株式会社 Electronic circuit housing case
JPS59149100A (en) * 1983-02-16 1984-08-25 富士通テン株式会社 Shield case
JPS60149165U (en) * 1984-03-13 1985-10-03 日本電気株式会社 printed wiring board
JPS619895U (en) * 1984-06-22 1986-01-21 株式会社日立製作所 Electronic circuit board storage case

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5043253U (en) * 1973-08-17 1975-05-01
JPS59149100A (en) * 1983-02-16 1984-08-25 富士通テン株式会社 Shield case
JPS5984865U (en) * 1983-09-01 1984-06-08 富士通株式会社 Electronic circuit housing case
JPS60149165U (en) * 1984-03-13 1985-10-03 日本電気株式会社 printed wiring board
JPS619895U (en) * 1984-06-22 1986-01-21 株式会社日立製作所 Electronic circuit board storage case

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH077283A (en) * 1992-09-01 1995-01-10 Tokyo Ingusu Kk Electromagnetic wave-shielded plastic molding
JPH0936581A (en) * 1995-07-25 1997-02-07 Toshiba Corp Shielding case and electronic equipment
EP0820218A1 (en) * 1996-07-20 1998-01-21 Siegfried Schaal Metallveredelung GmbH & Co. Electronic device and shielding cap for an electronic device
FR2798553A1 (en) * 1999-09-14 2001-03-16 Sagem PROTECTION DEVICE FOR ELECTRONIC COMPONENTS
US7541986B2 (en) 2003-07-23 2009-06-02 Lg Electronics Inc. Internal antenna and mobile terminal having the internal antenna
JP2012159935A (en) * 2011-01-31 2012-08-23 Murata Mfg Co Ltd Electronic component module, method for manufacturing electronic component module, and multifunctional card

Also Published As

Publication number Publication date
JP2514979B2 (en) 1996-07-10

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