JPS6461992A - Manufacture of wiring board - Google Patents

Manufacture of wiring board

Info

Publication number
JPS6461992A
JPS6461992A JP21939387A JP21939387A JPS6461992A JP S6461992 A JPS6461992 A JP S6461992A JP 21939387 A JP21939387 A JP 21939387A JP 21939387 A JP21939387 A JP 21939387A JP S6461992 A JPS6461992 A JP S6461992A
Authority
JP
Japan
Prior art keywords
wiring board
bent
board
parts
groove parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21939387A
Other languages
Japanese (ja)
Inventor
Munehiko Fukushima
Daizo Baba
Taizo Kitamura
Hajime Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21939387A priority Critical patent/JPS6461992A/en
Publication of JPS6461992A publication Critical patent/JPS6461992A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To manufacture a wiring board which has excellent flexibility and rigidity, can be bent into an arbitrary shape and enables three-dimensional wiring by a method wherein a metallic foil is arranged on the surface or rear side of a hard substrate provided with groove parts at parts to be bent through the intermediary of a plastic film to form circuits on a wiring board laminated and formed. CONSTITUTION:A metallic foil is arranged on the surface or rear side of a hard substrate provided with groove parts on the parts to be bent through the intermediary of a plastic film to make circuits on the wiring board lamination-formed. As for the hard structure, a resin laminated board or metallic board, etc., in single, alloyed or assembled form of aluminum, iron, copper, nickel, zinc, chrome, etc., are applicable. Besides, the recommended thickness is 0.1-3.0mm. The groove parts provided in the hard substrate can be bent taking arbitrary shape while the hard board excluding the groove parts can sustain the proper rigidity. After making the circuits, the title wiring board can be used as it is or arbitrarily punched out taking a specified shape.
JP21939387A 1987-09-02 1987-09-02 Manufacture of wiring board Pending JPS6461992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21939387A JPS6461992A (en) 1987-09-02 1987-09-02 Manufacture of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21939387A JPS6461992A (en) 1987-09-02 1987-09-02 Manufacture of wiring board

Publications (1)

Publication Number Publication Date
JPS6461992A true JPS6461992A (en) 1989-03-08

Family

ID=16734713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21939387A Pending JPS6461992A (en) 1987-09-02 1987-09-02 Manufacture of wiring board

Country Status (1)

Country Link
JP (1) JPS6461992A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH03157984A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
FR2871334A1 (en) * 2004-06-03 2005-12-09 Bree Beauce Realisations Et Et Fabrication of a semi-flexible printed circuit with a metal heat dissipation substrate, incorporating some hollowed zones, using conventional rigid circuit fabrication techniques
CN112702834A (en) * 2020-12-17 2021-04-23 万奔电子科技股份有限公司 Flexible rigid circuit board and preparation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03157985A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
JPH03157984A (en) * 1989-11-15 1991-07-05 Matsushita Electric Ind Co Ltd Metal board for mounting parts
FR2871334A1 (en) * 2004-06-03 2005-12-09 Bree Beauce Realisations Et Et Fabrication of a semi-flexible printed circuit with a metal heat dissipation substrate, incorporating some hollowed zones, using conventional rigid circuit fabrication techniques
CN112702834A (en) * 2020-12-17 2021-04-23 万奔电子科技股份有限公司 Flexible rigid circuit board and preparation method thereof

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