JPS645895Y2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention relates to a high power hybrid integrated circuit device with excellent heat dissipation effects.

(2) Background of the technology Since conventional hybrid integrated circuit elements have been used in many fields with relatively low power levels, no special consideration has been given to their heat dissipation. However, as hybrid integrated circuit elements are increasingly used in high-power fields such as power supply circuits, control circuits for various motors, and power amplifier circuits, their heat dissipation structure has become a problem, making them unsuitable for high-density packaging. There is a growing demand for the development of heat dissipation structures.

(3) Prior art and problems Figure 1 shows the heat dissipation structure of a conventional high power hybrid circuit. A method is adopted in which a sub-board 2 on which electronic components that generate a large amount of heat, such as a power transistor 1, is mounted is bonded to a block 3 made of copper or aluminum, and then bonded to a substrate 4.

However, when attaching multiple high-power semiconductor devices to the same substrate 4, the area occupied by each semiconductor must be set sufficiently large.
High-density packaging is not possible due to problems such as thermal interference occurring between the respective semiconductors through the semiconductor chip and the temperature of each semiconductor chip rising.

Also, as shown in Figure 2, a highly thermally conductive substrate made by laminating an aluminum plate 5, an epoxy resin 6, and a copper plate 7 is sometimes used, but in this case, the problem is that the thermal resistance is not so low because of the insulating layer (epoxy). There is.

(4) Purpose of the invention (4) Purpose of the invention The purpose of the invention is to solve the above conventional problems, incorporate a hybrid integrated circuit into the heat sink itself, which is normally used separately from the package, and improve the heat dissipation properties of the case body. The heat path from the heat-generating parts to the main body is simplified to make full use of the heat, and a low thermal resistance structure is realized.

(5) Structure of the invention According to the invention, the above purpose is to provide an aluminum heat sink having an external fin-like part, a recess for accommodating a hybrid integrated circuit therein, and a surface of which is copperized; A ceramic circuit board with electronic components mounted on the side, a metal layer printed on the back side, and soldered to the inner surface of the recess of the heat sink; This is achieved by a hybrid integrated circuit device comprising: a component; and a lid portion that hermetically seals the electronic component within a recess of the heat sink.

(6) Example of implementation of the idea Next, the present invention will be specifically explained with reference to the drawings.

FIG. 3 shows a cross-sectional view of a hybrid integrated circuit device according to an embodiment of the present invention.

A recess is provided in the main body of the heat sink 8, and a hybrid integrated circuit is housed inside the recess. The power transistor 1, which generates a large amount of heat, is bonded to an alumina substrate 9 by soldering, and a metal layer is formed by printing a silver para-based thick film paste on the back side of the alumina substrate, which is then coated on the surface of an aluminum heat sink. solder to. Other electronic parts 10,1
1 is similarly soldered to the surface of the aluminum heat sink. Surface copperization treatment involves thermochemically diffusing copper into the aluminum surface.
The surface is then plated with copper. Similarly, the lid 12 is connected to the seal portion of the case 8 by soldering and hermetically sealed. As the lid, for example, an aluminum plate whose surface is copperized can be used.

(7) Effects of the invention As explained above, the hybrid integrated circuit device of the invention has the advantage of achieving low thermal resistance because the alumina substrate and the heat sink body, which also serves as a case, can be directly soldered.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams of a conventional heat dissipation structure of a hybrid integrated circuit, and FIG. 3 is a sectional view of a hybrid integrated circuit device according to an embodiment of the present invention. In the figure, 1 is a power transistor, 8 is a heat sink (case), 9 is an alumina substrate, and 12 is a lid.

Claims (1)

[Scope of Claim for Utility Model Registration] An aluminum heat sink having an external fin-like part and a recessed part for accommodating a hybrid integrated circuit inside, the surface of which is copperized, and electronic components mounted on the surface side. a ceramic circuit board on which a metal layer is printed on the back surface and soldered to the inner surface of the recess of the heat sink; and an electronic component including a high power level semiconductor element mounted on the circuit board. 1. A hybrid integrated circuit comprising: a lid portion for hermetically sealing the electronic component within the recess of the heat sink.