JPS646053U - - Google Patents
Info
- Publication number
- JPS646053U JPS646053U JP1987101263U JP10126387U JPS646053U JP S646053 U JPS646053 U JP S646053U JP 1987101263 U JP1987101263 U JP 1987101263U JP 10126387 U JP10126387 U JP 10126387U JP S646053 U JPS646053 U JP S646053U
- Authority
- JP
- Japan
- Prior art keywords
- polarizer
- light
- resin body
- incident side
- polarization plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Description
第1図a,bは本考案の一実施例を示す光半導
体装置の一部切欠平面図及びA―A′線断面図、
第2図は第1図a,bに示す一実施例の斜視図、
第3図は従来の光半導体装置の一例を示す断面図
である。 1……受光素子、2,3……リード線、4……
金線、5……光透過性樹脂体、6,7……偏光子
、8……パツケージ、9……レンズ、10……光
透過性樹脂体、11……キヤツプ。
体装置の一部切欠平面図及びA―A′線断面図、
第2図は第1図a,bに示す一実施例の斜視図、
第3図は従来の光半導体装置の一例を示す断面図
である。 1……受光素子、2,3……リード線、4……
金線、5……光透過性樹脂体、6,7……偏光子
、8……パツケージ、9……レンズ、10……光
透過性樹脂体、11……キヤツプ。
Claims (1)
- 半導体受光素子を封止した光透過性樹脂体と、
前記光透過性樹脂体の光入射側に設けられた第1
の偏光子とを有するパツケージと、前記第1の偏
光子と相対する第2の偏光子を備え且つ前記第1
の偏光子の偏光面に対して前記第2の偏光子の偏
光面を回転できるように前記パツケージの光入射
側に取付けられた光透過性樹脂体からなるキヤツ
プとを含むことを特徴とする光半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101263U JPS646053U (ja) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987101263U JPS646053U (ja) | 1987-06-30 | 1987-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS646053U true JPS646053U (ja) | 1989-01-13 |
Family
ID=31330099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987101263U Pending JPS646053U (ja) | 1987-06-30 | 1987-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS646053U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001004878A (ja) * | 1999-06-23 | 2001-01-12 | Sharp Corp | 光送受信モジュール及び光ケーブル並びにそれらを用いた1芯双方向光通信システム |
| JP2002512436A (ja) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | 集積回路デバイス |
-
1987
- 1987-06-30 JP JP1987101263U patent/JPS646053U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002512436A (ja) * | 1998-02-06 | 2002-04-23 | シェルケース リミティド | 集積回路デバイス |
| US9530945B2 (en) | 1998-02-06 | 2016-12-27 | Invensas Corporation | Integrated circuit device |
| JP2001004878A (ja) * | 1999-06-23 | 2001-01-12 | Sharp Corp | 光送受信モジュール及び光ケーブル並びにそれらを用いた1芯双方向光通信システム |