JPS6461027A - Device for mounting chip - Google Patents

Device for mounting chip

Info

Publication number
JPS6461027A
JPS6461027A JP62218892A JP21889287A JPS6461027A JP S6461027 A JPS6461027 A JP S6461027A JP 62218892 A JP62218892 A JP 62218892A JP 21889287 A JP21889287 A JP 21889287A JP S6461027 A JPS6461027 A JP S6461027A
Authority
JP
Japan
Prior art keywords
chip
bump
reversing
attitude
attracted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62218892A
Other languages
Japanese (ja)
Inventor
Yoshiaki Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62218892A priority Critical patent/JPS6461027A/en
Publication of JPS6461027A publication Critical patent/JPS6461027A/en
Pending legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To eliminate manual labor in reversing a semiconductor chip and to largely improve working efficiency by reversing the chip upside down by a reversely feeding arm, disposing a bump in a downward attitude, and then placing it on a positioning unit. CONSTITUTION:A flip-chip 1 disposed on an expanding sheet 1 in an upward attitude of a bump 1a is first fed by a chip feeder 10, and placed on the movable end of a reversely feeding arm 5. The chip 1 attracted to and held at the movable end is placed on a positioning unit 9 by the reversing operation of the arm 5. In this case, the chip 1 is disposed in a downward attitude at its bump 1a. The chip 1 placed on the unit 9 to be positioned is attracted to and held at the feeder 10, fed to a predetermined position on a semiconductor substrate 5, and placed in the downward attitude of the bump 1a. Thus, its working efficiency can be largely improved.
JP62218892A 1987-08-31 1987-08-31 Device for mounting chip Pending JPS6461027A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62218892A JPS6461027A (en) 1987-08-31 1987-08-31 Device for mounting chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62218892A JPS6461027A (en) 1987-08-31 1987-08-31 Device for mounting chip

Publications (1)

Publication Number Publication Date
JPS6461027A true JPS6461027A (en) 1989-03-08

Family

ID=16726939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62218892A Pending JPS6461027A (en) 1987-08-31 1987-08-31 Device for mounting chip

Country Status (1)

Country Link
JP (1) JPS6461027A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188280A (en) * 1989-04-28 1993-02-23 Hitachi Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine
US5765277A (en) * 1995-09-30 1998-06-16 Samsung Electronics Co., Ltd. Die bonding apparatus with a revolving pick-up tool
EP0895450A3 (en) * 1997-07-28 1999-11-03 Matsushita Electric Industrial Co., Ltd. Component feeder and mounter
JP2003092313A (en) * 2001-09-19 2003-03-28 Nec Machinery Corp Chip reversing device and die bonder
US7028392B1 (en) 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP2007053156A (en) * 2005-08-16 2007-03-01 Matsushita Electric Ind Co Ltd Chip reversing device, chip reversing method, chip mounting device and chip mounting method
US20120085812A1 (en) * 2010-10-08 2012-04-12 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
KR20170006962A (en) * 2015-07-10 2017-01-18 한화테크윈 주식회사 Chip mounter

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188280A (en) * 1989-04-28 1993-02-23 Hitachi Ltd. Method of bonding metals, and method and apparatus for producing semiconductor integrated circuit device using said method of bonding metals
US5609292A (en) * 1992-12-04 1997-03-11 International Business Machines Corporation Manufacturing circuit boards using a pick and place machine
US5765277A (en) * 1995-09-30 1998-06-16 Samsung Electronics Co., Ltd. Die bonding apparatus with a revolving pick-up tool
EP0895450A3 (en) * 1997-07-28 1999-11-03 Matsushita Electric Industrial Co., Ltd. Component feeder and mounter
US6467158B1 (en) 1997-07-28 2002-10-22 Matsushita Electric Industrial Co., Ltd. Component feeder with load position alignment recognition
US7028392B1 (en) 1999-03-05 2006-04-18 Siemens Dematic Ag Device for fitting a substrate with a flip chip
JP2003092313A (en) * 2001-09-19 2003-03-28 Nec Machinery Corp Chip reversing device and die bonder
JP2007053156A (en) * 2005-08-16 2007-03-01 Matsushita Electric Ind Co Ltd Chip reversing device, chip reversing method, chip mounting device and chip mounting method
WO2007021029A3 (en) * 2005-08-16 2007-06-28 Matsushita Electric Industrial Co Ltd Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method
US20120085812A1 (en) * 2010-10-08 2012-04-12 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
US8196798B2 (en) * 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
US8251274B1 (en) 2010-10-08 2012-08-28 Orthodyne Electronics Corporation Solar substrate ribbon bonding system
KR20170006962A (en) * 2015-07-10 2017-01-18 한화테크윈 주식회사 Chip mounter

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