JPS6461981A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPS6461981A JPS6461981A JP21939487A JP21939487A JPS6461981A JP S6461981 A JPS6461981 A JP S6461981A JP 21939487 A JP21939487 A JP 21939487A JP 21939487 A JP21939487 A JP 21939487A JP S6461981 A JPS6461981 A JP S6461981A
- Authority
- JP
- Japan
- Prior art keywords
- slits
- hard substrate
- circuit
- bending
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 8
- 229910052751 metal Inorganic materials 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 4
- 238000005452 bending Methods 0.000 abstract 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 2
- 238000003475 lamination Methods 0.000 abstract 2
- 239000002985 plastic film Substances 0.000 abstract 2
- 229920006255 plastic film Polymers 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To obtain a wiring board, having excellent flexibility and rigidity, on which a bending work for formation of an arbitrary shape can be conducted by a method wherein a metal foil is provided through the intermediary of a plastic film on the upper surface and/or the lower surface of the hard substrate on which required number of slits are provided on the expected part of bending, and after a circuit has been formed by wiring substrate formed by lamination, the hard substrate located between slits is removed. CONSTITUTION:A sheet of metal foil is arranged on the upper surface and/or the lower surface of the hard substrate on which required number of slits are provided at the expected part for bending through the intermediary of a plastic film, and after a circuit has been formed on the circuit substrate obtained by lamination, the hard substrate between slits is removed. A resin-laminated plate, and an independent metal, an alloy, a combination of metals and the like of aluminum, iron, copper, nickel, zinc, chromium and the like is used for the hard substrate, the thickness of 0.1-3.0mm is desirable from the viewpoint of handling. Pertaining to the removal of the hard substrate located between slits, the chemical treatment such as an etching treatment and the like, and the physical treatment such as grinding and the like can be optionally used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21939487A JPS6461981A (en) | 1987-09-02 | 1987-09-02 | Manufacture of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21939487A JPS6461981A (en) | 1987-09-02 | 1987-09-02 | Manufacture of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6461981A true JPS6461981A (en) | 1989-03-08 |
Family
ID=16734726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21939487A Pending JPS6461981A (en) | 1987-09-02 | 1987-09-02 | Manufacture of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6461981A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5398128A (en) * | 1991-05-21 | 1995-03-14 | Sharp Kabushiki Kaisha | Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending |
| FR2871334A1 (en) * | 2004-06-03 | 2005-12-09 | Bree Beauce Realisations Et Et | Fabrication of a semi-flexible printed circuit with a metal heat dissipation substrate, incorporating some hollowed zones, using conventional rigid circuit fabrication techniques |
-
1987
- 1987-09-02 JP JP21939487A patent/JPS6461981A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5398128A (en) * | 1991-05-21 | 1995-03-14 | Sharp Kabushiki Kaisha | Wiring board for use in a liquid crystal panel and method of making including forming resin over slit before bending |
| FR2871334A1 (en) * | 2004-06-03 | 2005-12-09 | Bree Beauce Realisations Et Et | Fabrication of a semi-flexible printed circuit with a metal heat dissipation substrate, incorporating some hollowed zones, using conventional rigid circuit fabrication techniques |
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