JPS6439093A - Manufacture of electronic part mounting board - Google Patents

Manufacture of electronic part mounting board

Info

Publication number
JPS6439093A
JPS6439093A JP19580387A JP19580387A JPS6439093A JP S6439093 A JPS6439093 A JP S6439093A JP 19580387 A JP19580387 A JP 19580387A JP 19580387 A JP19580387 A JP 19580387A JP S6439093 A JPS6439093 A JP S6439093A
Authority
JP
Japan
Prior art keywords
board
hole
bonding agent
semi
agent layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19580387A
Other languages
Japanese (ja)
Inventor
Takeshi Kano
Toru Higuchi
Munetake Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP19580387A priority Critical patent/JPS6439093A/en
Publication of JPS6439093A publication Critical patent/JPS6439093A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To prevent position deviation due to sliding of both boards, by laminating the first board and the second board with a semi-hardening bonding agent layer having no fluidity or less fluidity. CONSTITUTION:A through hole 2 is provided for mounting an electronic part in a first board 3. A semi-hardening bonding agent layer 4 is formed on the rear surface of the first board 3. A through hole 6, which is larger than the through-hole 2, is provided in the second board 5. The inner surface part of the through-hole 2 is made to protrude from the inner surface of the through-hole 6. The second board 5 is laminated on the rear surface of the first board 3. A metal plate 7, which is enclosed in the through-hole 6, is brought into contact with the rear surface of the inner surface of the through-hole 2. Thereafter, the semi-hardening bonding agent layer 4 is hardened, and the second board 5 and the metal plate 7 are bonded to the rear surface of the first board 3. The first board 3 and the second board 5 are laminated with the semi- hardening bonding agent layer 4 having no fluidity or low fluidity. Thus, the position deviation of both boards 5 due to the sliding when the first board 3 and the second board 5 are laminated can be prevented. The extrusion of the bonding agent of the semi-hardening bonding agent layer 4 from the inner surface of the through-hole 2 is prevented.
JP19580387A 1987-08-05 1987-08-05 Manufacture of electronic part mounting board Pending JPS6439093A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19580387A JPS6439093A (en) 1987-08-05 1987-08-05 Manufacture of electronic part mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19580387A JPS6439093A (en) 1987-08-05 1987-08-05 Manufacture of electronic part mounting board

Publications (1)

Publication Number Publication Date
JPS6439093A true JPS6439093A (en) 1989-02-09

Family

ID=16347239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19580387A Pending JPS6439093A (en) 1987-08-05 1987-08-05 Manufacture of electronic part mounting board

Country Status (1)

Country Link
JP (1) JPS6439093A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229451B2 (en) * 1972-12-12 1977-08-02
JPS60247992A (en) * 1984-05-23 1985-12-07 株式会社日立製作所 Integrated circuit chip mounting board
JPS6134990A (en) * 1984-07-25 1986-02-19 イビデン株式会社 Substrate for placing electronic part and method of producing same
JPS61189697A (en) * 1985-02-19 1986-08-23 イビデン株式会社 Substrate for carrying electronic component and manufacture thereof
JPS61202495A (en) * 1985-03-05 1986-09-08 イビデン株式会社 Substrate for carrying electronic component and manufacture thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5229451B2 (en) * 1972-12-12 1977-08-02
JPS60247992A (en) * 1984-05-23 1985-12-07 株式会社日立製作所 Integrated circuit chip mounting board
JPS6134990A (en) * 1984-07-25 1986-02-19 イビデン株式会社 Substrate for placing electronic part and method of producing same
JPS61189697A (en) * 1985-02-19 1986-08-23 イビデン株式会社 Substrate for carrying electronic component and manufacture thereof
JPS61202495A (en) * 1985-03-05 1986-09-08 イビデン株式会社 Substrate for carrying electronic component and manufacture thereof

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