JPS6464392A - Transcription sheet for circuit formation use and manufacture of circuit board using transcription sheet - Google Patents

Transcription sheet for circuit formation use and manufacture of circuit board using transcription sheet

Info

Publication number
JPS6464392A
JPS6464392A JP62222390A JP22239087A JPS6464392A JP S6464392 A JPS6464392 A JP S6464392A JP 62222390 A JP62222390 A JP 62222390A JP 22239087 A JP22239087 A JP 22239087A JP S6464392 A JPS6464392 A JP S6464392A
Authority
JP
Japan
Prior art keywords
face
sheet
smooth
substrate sheet
rough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62222390A
Other languages
Japanese (ja)
Other versions
JP2572071B2 (en
Inventor
Takeshi Sato
Katsuya Fukase
Hirofumi Uchida
Seiki Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP62222390A priority Critical patent/JP2572071B2/en
Priority to KR8810942A priority patent/KR910003701B1/en
Priority to US07/240,216 priority patent/US4969257A/en
Publication of JPS6464392A publication Critical patent/JPS6464392A/en
Application granted granted Critical
Publication of JP2572071B2 publication Critical patent/JP2572071B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To form a circuit pattern finely and with high accuracy by a method wherein electrolytic metal foil where one face is smooth and the other face is rough is attached to a flexible substrate sheet to be detachable on the side of the smooth face. CONSTITUTION:A transcription sheet 10 is formed by attaching electrolytic copper foil 12 to a substrate sheet 14 via an exfoliation layer 16 while the side of a smooth face 12a faces toward the substrate sheet 14 and the side of a rough face 12b faces in a reverse direction. As the substrate sheet 14, a resin sheet composed of a polyamide or the like which is heat-resistant and flexible is used. The electrolytic copper foil 12 is formed in such a way that copper is electrodeposited on a drum-shaped electrode whose surface has been mirror-finished and that it is exfoliated from the drum-shaped electrode; one face side is a mirror-like smooth face; the other face is formed to be rough; in addition, various treatments are executed on the face; the face becomes rougher and has fine protrusions 12 whose tip parts have swollen. If the electrolytic copper foil 12 of the above transcription sheet 10 is processed by photoetching, a fine circuit pattern is formed with high accuracy.
JP62222390A 1987-09-04 1987-09-04 Method for manufacturing circuit board using transfer sheet Expired - Lifetime JP2572071B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62222390A JP2572071B2 (en) 1987-09-04 1987-09-04 Method for manufacturing circuit board using transfer sheet
KR8810942A KR910003701B1 (en) 1987-09-04 1988-08-27 Transcription sheet for circuit formation use and manufacture of circuit board using transcription sheet
US07/240,216 US4969257A (en) 1987-09-04 1988-09-06 Transfer sheet and process for making a circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222390A JP2572071B2 (en) 1987-09-04 1987-09-04 Method for manufacturing circuit board using transfer sheet

Publications (2)

Publication Number Publication Date
JPS6464392A true JPS6464392A (en) 1989-03-10
JP2572071B2 JP2572071B2 (en) 1997-01-16

Family

ID=16781612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222390A Expired - Lifetime JP2572071B2 (en) 1987-09-04 1987-09-04 Method for manufacturing circuit board using transfer sheet

Country Status (2)

Country Link
JP (1) JP2572071B2 (en)
KR (1) KR910003701B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216892A (en) * 1989-02-17 1990-08-29 Nippon Koudoshi Kogyo Kk Laminate for printed circuit board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024185566A1 (en) 2023-03-07 2024-09-12 日本発條株式会社 Method for producing circuit pattern, method for producing circuit board, and circuit pattern
CN121549065A (en) 2023-07-26 2026-02-17 日本发条株式会社 Method for manufacturing a circuit pattern assembly with a release film, method for manufacturing a circuit board, and a circuit pattern assembly with a release film.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60164392A (en) * 1984-02-07 1985-08-27 日本電産コパル株式会社 Method of forming circuit board
JPS6233493A (en) * 1985-08-07 1987-02-13 キヤノン株式会社 Transfer sheet manufacturing method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60164392A (en) * 1984-02-07 1985-08-27 日本電産コパル株式会社 Method of forming circuit board
JPS6233493A (en) * 1985-08-07 1987-02-13 キヤノン株式会社 Transfer sheet manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02216892A (en) * 1989-02-17 1990-08-29 Nippon Koudoshi Kogyo Kk Laminate for printed circuit board

Also Published As

Publication number Publication date
KR890006117A (en) 1989-05-18
KR910003701B1 (en) 1991-06-08
JP2572071B2 (en) 1997-01-16

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