JPS6430291A - Material of flexible printed circuit board - Google Patents
Material of flexible printed circuit boardInfo
- Publication number
- JPS6430291A JPS6430291A JP18701887A JP18701887A JPS6430291A JP S6430291 A JPS6430291 A JP S6430291A JP 18701887 A JP18701887 A JP 18701887A JP 18701887 A JP18701887 A JP 18701887A JP S6430291 A JPS6430291 A JP S6430291A
- Authority
- JP
- Japan
- Prior art keywords
- film
- heat
- resistant adhesive
- polyethersulfone
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract 2
- 239000004695 Polyether sulfone Substances 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 239000011888 foil Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 229920006393 polyether sulfone Polymers 0.000 abstract 3
- 238000003851 corona treatment Methods 0.000 abstract 2
- 238000009832 plasma treatment Methods 0.000 abstract 2
- 238000009736 wetting Methods 0.000 abstract 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004925 Acrylic resin Substances 0.000 abstract 1
- 229920000178 Acrylic resin Polymers 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- 230000032798 delamination Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 239000011229 interlayer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To obtain relatively low cost flexible printed circuit board material with excellent heat-resistant property, flame-retardant property and dimensional stability and free from voids and interlayer delamination by a method wherein a polyethersulfone film is subjected to a corona discharge treatment or a plasma treatment to obtain a surface wetting tension not less than a specific value and a metal foil is bonded to the film with heat-resistant adhesive. CONSTITUTION:A polyethersulfone film is subjected to a corona discharge treatment or plasma treatment to obtain a surface wetting tension not less than 42dyne/cm and a metal foil, typically a copper foil, is bonded to the film with heat-resistant adhesive. Needless to say, the metal foils may be applied to not only one side of the film but also both sides of the film. The polyethersulfone film with a thickness of 4-300mum is employed. If the film is too thin, the physical strength is not sufficient and, if the film is too thick, the flexibility is not sufficient. The preferable thickness range is 15-50mum. As the heat-resistant adhesive, thermosetting type epoxy resin system or acrylic resin system is recommended.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18701887A JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18701887A JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430291A true JPS6430291A (en) | 1989-02-01 |
Family
ID=16198757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18701887A Pending JPS6430291A (en) | 1987-07-27 | 1987-07-27 | Material of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430291A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1422055A4 (en) * | 2001-07-30 | 2006-12-20 | Mitsui Mining & Smelting Co | Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| US8221846B2 (en) | 2002-05-02 | 2012-07-17 | Hussmann Corporation | Merchandisers having anti-fog coatings and methods for making the same |
| JPWO2012169550A1 (en) * | 2011-06-06 | 2015-02-23 | 凸版印刷株式会社 | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| US20180126716A1 (en) * | 2015-05-26 | 2018-05-10 | Thyssenkrupp Steel Europe Ag | Production of composite material by means of plasma coating |
-
1987
- 1987-07-27 JP JP18701887A patent/JPS6430291A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1422055A4 (en) * | 2001-07-30 | 2006-12-20 | Mitsui Mining & Smelting Co | Capacitor layer forming both-side copper-clad laminated heet and production method therefor |
| US8221846B2 (en) | 2002-05-02 | 2012-07-17 | Hussmann Corporation | Merchandisers having anti-fog coatings and methods for making the same |
| JPWO2012169550A1 (en) * | 2011-06-06 | 2015-02-23 | 凸版印刷株式会社 | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| JP2017199918A (en) * | 2011-06-06 | 2017-11-02 | ディーエスエム アイピー アセッツ ビー．ブイ． | Metal foil pattern laminate, metal foil laminate, metal foil laminate substrate, solar cell module, and method for producing metal foil pattern laminate |
| US20180126716A1 (en) * | 2015-05-26 | 2018-05-10 | Thyssenkrupp Steel Europe Ag | Production of composite material by means of plasma coating |
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