JPS6465078A - Bonding structure of ceramic - Google Patents
Bonding structure of ceramicInfo
- Publication number
- JPS6465078A JPS6465078A JP22137887A JP22137887A JPS6465078A JP S6465078 A JPS6465078 A JP S6465078A JP 22137887 A JP22137887 A JP 22137887A JP 22137887 A JP22137887 A JP 22137887A JP S6465078 A JPS6465078 A JP S6465078A
- Authority
- JP
- Japan
- Prior art keywords
- intermediate material
- ceramic
- edge
- small
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title abstract 9
- 239000000463 material Substances 0.000 abstract 12
- 230000008646 thermal stress Effects 0.000 abstract 3
- 238000004299 exfoliation Methods 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Abstract
PURPOSE:To prevent generation of crack, breakage, and exfoliation of a ceramic body due to thermal stress when a ceramic body is bonded to a mother material interposing an intermediate material by setting backward an edge of the intermediate material from the ceramic side to the mother material side gradually. CONSTITUTION:A ceramic small piece 1 is bonded to a mother material 3 of a partner member interposing an intermediate material 2. In this case, an edge 2a of the intermediate material 2 is set backward gradually to the inner side than the edge 1a of the small ceramic piece 1 as the edge 2a of the intermediate material 2 is apart further from the small ceramic piece 1 side toward the mother material 3 side. By this constitution, a space for liberating thermal stress generated by the difference of coefft. of thermal expansion between the small ceramic piece 1 and the intermediate material 2 is formed in a part where the edge 2a of the intermediate material 2 is set back, thus, concentration of thermal stress to the periphery of interface between the small ceramic piece 1 and the intermediate material bonded thereto is moderated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22137887A JPS6465078A (en) | 1987-09-04 | 1987-09-04 | Bonding structure of ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22137887A JPS6465078A (en) | 1987-09-04 | 1987-09-04 | Bonding structure of ceramic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6465078A true JPS6465078A (en) | 1989-03-10 |
Family
ID=16765847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22137887A Pending JPS6465078A (en) | 1987-09-04 | 1987-09-04 | Bonding structure of ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6465078A (en) |
-
1987
- 1987-09-04 JP JP22137887A patent/JPS6465078A/en active Pending
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