JPS645026A - Bonding tool - Google Patents

Bonding tool

Info

Publication number
JPS645026A
JPS645026A JP62160005A JP16000587A JPS645026A JP S645026 A JPS645026 A JP S645026A JP 62160005 A JP62160005 A JP 62160005A JP 16000587 A JP16000587 A JP 16000587A JP S645026 A JPS645026 A JP S645026A
Authority
JP
Japan
Prior art keywords
bonding
bonding tool
same material
generating
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62160005A
Other languages
Japanese (ja)
Other versions
JPH0744203B2 (en
Inventor
Junichi Okamoto
Kazuyuki Shimada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62160005A priority Critical patent/JPH0744203B2/en
Publication of JPS645026A publication Critical patent/JPS645026A/en
Publication of JPH0744203B2 publication Critical patent/JPH0744203B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a bonding tool from generating warp, and improve the yiels of bonding, by forming the bonding tool of the same material, and providing the bottom part with a diamond coating film. CONSTITUTION:A bonding tool is formed of the same material. A surface facing a junction part is provided with a diamond coating film 11. The warp of bonding tool generating at the time of bonding wherein a semiconductor element electrode and a film carrier lead are subjected to thermocompression bonding is prevented from generating, because the same material is used and unified in a body, so that the difference of thermal expansion coefficient does not exist. Further, as the film 11 is formed, cracks do not generate at the edge part of the bottom of the bonding tool. Thereby, the yield of bonding can be improved.
JP62160005A 1987-06-26 1987-06-26 Bonding tools Expired - Lifetime JPH0744203B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62160005A JPH0744203B2 (en) 1987-06-26 1987-06-26 Bonding tools

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62160005A JPH0744203B2 (en) 1987-06-26 1987-06-26 Bonding tools

Publications (2)

Publication Number Publication Date
JPS645026A true JPS645026A (en) 1989-01-10
JPH0744203B2 JPH0744203B2 (en) 1995-05-15

Family

ID=15705918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62160005A Expired - Lifetime JPH0744203B2 (en) 1987-06-26 1987-06-26 Bonding tools

Country Status (1)

Country Link
JP (1) JPH0744203B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01162241U (en) * 1988-04-25 1989-11-10
JPH0334239U (en) * 1989-08-15 1991-04-04
JPH0425138A (en) * 1990-05-18 1992-01-28 Sumitomo Electric Ind Ltd Bonding tool
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication
US5370299A (en) * 1992-04-23 1994-12-06 Sumitomo Electric Industries, Ltd. Bonding tool having diamond head and method of manufacturing the same
JPH0786341A (en) * 1993-09-10 1995-03-31 Sony Corp Thermocompression bonding tool and thermocompression bonding apparatus using the same
JP2006210534A (en) * 2005-01-26 2006-08-10 Sumitomo Electric Hardmetal Corp Mounting tool
US20170221852A1 (en) * 2014-09-29 2017-08-03 Danfoss Silicon Power Gmbh Sintering tool for the lower die of a sintering device
US10483229B2 (en) 2014-09-29 2019-11-19 Danfoss Silicon Power Gmbh Sintering device
US10814396B2 (en) 2014-09-29 2020-10-27 Danfoss Silicon Power Gmbh Sintering tool and method for sintering an electronic subassembly
KR20210138279A (en) * 2020-05-12 2021-11-19 한국야금 주식회사 Diamond coated bonding tools
US11776932B2 (en) 2014-09-29 2023-10-03 Danfoss Silicon Power Gmbh Process and device for low-temperature pressure sintering

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01162241U (en) * 1988-04-25 1989-11-10
JPH0334239U (en) * 1989-08-15 1991-04-04
JPH0425138A (en) * 1990-05-18 1992-01-28 Sumitomo Electric Ind Ltd Bonding tool
US5213248A (en) * 1992-01-10 1993-05-25 Norton Company Bonding tool and its fabrication
US5516027A (en) * 1992-04-23 1996-05-14 Sumitomo Electric Industries, Ltd. Bonding tool having a diamond head and method of manufacturing the same
US5370299A (en) * 1992-04-23 1994-12-06 Sumitomo Electric Industries, Ltd. Bonding tool having diamond head and method of manufacturing the same
JPH0786341A (en) * 1993-09-10 1995-03-31 Sony Corp Thermocompression bonding tool and thermocompression bonding apparatus using the same
JP2006210534A (en) * 2005-01-26 2006-08-10 Sumitomo Electric Hardmetal Corp Mounting tool
US20170221852A1 (en) * 2014-09-29 2017-08-03 Danfoss Silicon Power Gmbh Sintering tool for the lower die of a sintering device
US10483229B2 (en) 2014-09-29 2019-11-19 Danfoss Silicon Power Gmbh Sintering device
US10818633B2 (en) * 2014-09-29 2020-10-27 Danfoss Silicon Power Gmbh Sintering tool for the lower die of a sintering device
US10814396B2 (en) 2014-09-29 2020-10-27 Danfoss Silicon Power Gmbh Sintering tool and method for sintering an electronic subassembly
US11776932B2 (en) 2014-09-29 2023-10-03 Danfoss Silicon Power Gmbh Process and device for low-temperature pressure sintering
KR20210138279A (en) * 2020-05-12 2021-11-19 한국야금 주식회사 Diamond coated bonding tools

Also Published As

Publication number Publication date
JPH0744203B2 (en) 1995-05-15

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