JPS6465293A - Method for plating thin metallic plate - Google Patents

Method for plating thin metallic plate

Info

Publication number
JPS6465293A
JPS6465293A JP22125887A JP22125887A JPS6465293A JP S6465293 A JPS6465293 A JP S6465293A JP 22125887 A JP22125887 A JP 22125887A JP 22125887 A JP22125887 A JP 22125887A JP S6465293 A JPS6465293 A JP S6465293A
Authority
JP
Japan
Prior art keywords
thin metallic
metallic plate
plating
plated
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22125887A
Other languages
Japanese (ja)
Inventor
Akira Ishiwatari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISHIWATA KK
Original Assignee
ISHIWATA KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISHIWATA KK filed Critical ISHIWATA KK
Priority to JP22125887A priority Critical patent/JPS6465293A/en
Publication of JPS6465293A publication Critical patent/JPS6465293A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To improve finish after plating and to make polishing unnecessary when a thin metallic plate having a watermark is plated, by carrying out plating with Ni for an underlayer and plating with a metal such as Ag, Au or Rh and by specifying the thickness of the plate and that of the resulting plating layer. CONSTITUTION:A thin metallic plate of 0.2-1mm thickness having a watermark is prepd. Both sides of the plate are plated with Ni to form an underlayer and the plated sides are electroplated with a metal such as Ag, Au, Rh or Cr. The thickness of the resulting plating layer is regulated to 5-30mum.
JP22125887A 1987-09-04 1987-09-04 Method for plating thin metallic plate Pending JPS6465293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22125887A JPS6465293A (en) 1987-09-04 1987-09-04 Method for plating thin metallic plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22125887A JPS6465293A (en) 1987-09-04 1987-09-04 Method for plating thin metallic plate

Publications (1)

Publication Number Publication Date
JPS6465293A true JPS6465293A (en) 1989-03-10

Family

ID=16763951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22125887A Pending JPS6465293A (en) 1987-09-04 1987-09-04 Method for plating thin metallic plate

Country Status (1)

Country Link
JP (1) JPS6465293A (en)

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