JPS6467968A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6467968A
JPS6467968A JP22505087A JP22505087A JPS6467968A JP S6467968 A JPS6467968 A JP S6467968A JP 22505087 A JP22505087 A JP 22505087A JP 22505087 A JP22505087 A JP 22505087A JP S6467968 A JPS6467968 A JP S6467968A
Authority
JP
Japan
Prior art keywords
region
type
semiconductor device
breakdown strength
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22505087A
Other languages
Japanese (ja)
Inventor
Kayoko Omoto
Kazuaki Miyata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22505087A priority Critical patent/JPS6467968A/en
Publication of JPS6467968A publication Critical patent/JPS6467968A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To reduce the resistance of a second drain region and to obtain a high breakdown strength semiconductor device by forming a drain region on the same conductivity type second impurity diffused region. CONSTITUTION:A P-type source region 4, a P<+> type drain region 5, a P<-> type drain region 9 and a gate electrode 8 form a P-channel field effect transistor. Since the drain regions 5, 9 are formed on the same conductivity type P-well region 3, the resistance of the region 9 is reduced, and its mutual conductance is raised. On the other hand, since a thick oxide film 7 is provided, the electrode 8 and the region 6 are scarcely short-circuited therebetween. Since its breakdown strength is determined by the junction of an N-type well region 2 and a P-type well region 3, a semiconductor device having a high breakdown strength is obtained.
JP22505087A 1987-09-08 1987-09-08 Semiconductor device Pending JPS6467968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22505087A JPS6467968A (en) 1987-09-08 1987-09-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22505087A JPS6467968A (en) 1987-09-08 1987-09-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6467968A true JPS6467968A (en) 1989-03-14

Family

ID=16823251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22505087A Pending JPS6467968A (en) 1987-09-08 1987-09-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6467968A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359161B1 (en) * 1999-12-31 2002-10-31 주식회사 하이닉스반도체 A method for fabricating transistor of a semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100359161B1 (en) * 1999-12-31 2002-10-31 주식회사 하이닉스반도체 A method for fabricating transistor of a semiconductor device

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