JPS6472579A - Positioning and fixing structure for semiconductor laser chip and input lens - Google Patents

Positioning and fixing structure for semiconductor laser chip and input lens

Info

Publication number
JPS6472579A
JPS6472579A JP62227561A JP22756187A JPS6472579A JP S6472579 A JPS6472579 A JP S6472579A JP 62227561 A JP62227561 A JP 62227561A JP 22756187 A JP22756187 A JP 22756187A JP S6472579 A JPS6472579 A JP S6472579A
Authority
JP
Japan
Prior art keywords
input lens
semiconductor laser
protrusion
laser chip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62227561A
Other languages
Japanese (ja)
Inventor
Kenji Tagawa
Takayuki Masuko
Shoichi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62227561A priority Critical patent/JPS6472579A/en
Publication of JPS6472579A publication Critical patent/JPS6472579A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To easily position a semiconductor laser chip and an input lens on an optical axis by disposing an input lens mounting and supporting member by inserting the columnar protrusion of a heat sink member into a slotlike mounting hole in a state that it is brought into contact with the hole at two positions in its radial direction. CONSTITUTION:A semiconductor laser chip 34 is fixedly mounted on a heat sink member 38, an input lens 40 is mounted on a mounting and supporting member 42, a columnar protrusion 46 protrudes from the member 38, and slotlike mounting hole 48 is formed at the member 42 in a state that the protrusion 46 is so inserted into the holes that it is brought into contact with the holes at two radial positions. The member 42 is displaced longitudinally of the member 38, longitudinally of the hole 48 and circumferentially of the protrusion 46 to position the chip 34 and the lens 40 on an optical axis, and the protrusion 46 is, after the positioning, physically secured, for example, by soldering or laser welding to the member 42 in the hole 48.
JP62227561A 1987-09-12 1987-09-12 Positioning and fixing structure for semiconductor laser chip and input lens Pending JPS6472579A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62227561A JPS6472579A (en) 1987-09-12 1987-09-12 Positioning and fixing structure for semiconductor laser chip and input lens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62227561A JPS6472579A (en) 1987-09-12 1987-09-12 Positioning and fixing structure for semiconductor laser chip and input lens

Publications (1)

Publication Number Publication Date
JPS6472579A true JPS6472579A (en) 1989-03-17

Family

ID=16862838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62227561A Pending JPS6472579A (en) 1987-09-12 1987-09-12 Positioning and fixing structure for semiconductor laser chip and input lens

Country Status (1)

Country Link
JP (1) JPS6472579A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196187A (en) * 1988-02-01 1989-08-07 Sumitomo Electric Ind Ltd Optical apparatus and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01196187A (en) * 1988-02-01 1989-08-07 Sumitomo Electric Ind Ltd Optical apparatus and its manufacture

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