JPS6474784A - Fixing structure for positioning semiconductor laser chip and input lens - Google Patents

Fixing structure for positioning semiconductor laser chip and input lens

Info

Publication number
JPS6474784A
JPS6474784A JP23093087A JP23093087A JPS6474784A JP S6474784 A JPS6474784 A JP S6474784A JP 23093087 A JP23093087 A JP 23093087A JP 23093087 A JP23093087 A JP 23093087A JP S6474784 A JPS6474784 A JP S6474784A
Authority
JP
Japan
Prior art keywords
heat sink
mounting support
support member
sink member
projection section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23093087A
Other languages
Japanese (ja)
Inventor
Hiroki Okujima
Kenji Tagawa
Takayuki Masuko
Shoichi Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23093087A priority Critical patent/JPS6474784A/en
Publication of JPS6474784A publication Critical patent/JPS6474784A/en
Pending legal-status Critical Current

Links

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To conduct the positioning displacement adjustment of a mounting support member to a heat sink member easily and rapidly by utilizing the relative contacting positions of the heat sink member and a projection section for the mounting support member as a reference position. CONSTITUTION:A mounting support member 38 can be displaced in the front and rear direction, the vertical direction, the left and the right direction, etc., to a heat sink member 34 by bringing a projection section 44 in the mounting support member 38 along a straight line into contact with the heat sink member 34. Even when the mounting support member 38 is used as a fine adjustment base, the mounting support member 38 is maintained under a contacting state at all times with the heat sink member 34 by the projection section 44 when the mounting support member is displaced to the heat sink member 34, thus allowing alignment displacement adjustment by employing the relative contacting positions of the heat sink member 34 and the projection section 44 as a reference position on the positioning operation of a semiconductor laser chip 30 and a spherical lens 36.
JP23093087A 1987-09-17 1987-09-17 Fixing structure for positioning semiconductor laser chip and input lens Pending JPS6474784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23093087A JPS6474784A (en) 1987-09-17 1987-09-17 Fixing structure for positioning semiconductor laser chip and input lens

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23093087A JPS6474784A (en) 1987-09-17 1987-09-17 Fixing structure for positioning semiconductor laser chip and input lens

Publications (1)

Publication Number Publication Date
JPS6474784A true JPS6474784A (en) 1989-03-20

Family

ID=16915514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23093087A Pending JPS6474784A (en) 1987-09-17 1987-09-17 Fixing structure for positioning semiconductor laser chip and input lens

Country Status (1)

Country Link
JP (1) JPS6474784A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438580A (en) * 1993-09-24 1995-08-01 Opto Power Corporation Laser package and method of assembly
WO2012157240A1 (en) * 2011-05-18 2012-11-22 パナソニック株式会社 Semiconductor laser module and method for manufacturing same
TWI405026B (en) * 2009-07-29 2013-08-11 Qisda Corp Projector and lens thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5438580A (en) * 1993-09-24 1995-08-01 Opto Power Corporation Laser package and method of assembly
TWI405026B (en) * 2009-07-29 2013-08-11 Qisda Corp Projector and lens thereof
WO2012157240A1 (en) * 2011-05-18 2012-11-22 パナソニック株式会社 Semiconductor laser module and method for manufacturing same
US8985870B2 (en) 2011-05-18 2015-03-24 Panasonic Intellectual Property Management Co., Ltd. Semiconductor laser module and method for manufacturing same
US9093812B2 (en) 2011-05-18 2015-07-28 Panasonic Intellectual Property Management Co., Ltd. Method of manufacturing a semiconductor laser module

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