JPS6472592A - Manufacture of ceramic leadless package - Google Patents

Manufacture of ceramic leadless package

Info

Publication number
JPS6472592A
JPS6472592A JP22755687A JP22755687A JPS6472592A JP S6472592 A JPS6472592 A JP S6472592A JP 22755687 A JP22755687 A JP 22755687A JP 22755687 A JP22755687 A JP 22755687A JP S6472592 A JPS6472592 A JP S6472592A
Authority
JP
Japan
Prior art keywords
hole
outer edge
conductor paste
conductor
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22755687A
Other languages
Japanese (ja)
Other versions
JPH0529145B2 (en
Inventor
Takuji Yamamoto
Mutsumi Kitagawa
Kunimitsu Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP22755687A priority Critical patent/JPS6472592A/en
Publication of JPS6472592A publication Critical patent/JPS6472592A/en
Publication of JPH0529145B2 publication Critical patent/JPH0529145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To plate a side conductor uniformly in thickness without plating an unnecessary part by coating the interior of a through hole with conductor paste, then extending the hole to the outer edge of the hole, and opening a second through hole for removing the conductor paste layer of the outer edge. CONSTITUTION:First through holes 7 are opened at a package body 1 and the connector of the outer edge 2 of the body, and ceramic green sheets 3a, 3b coated with conductor pastes 8a, 8b are formed on the inner walls of the holes. Then, after second through holes 9 are so formed as to be superposed on the inner wall of the outer edge 2 of the hole 7, the sheets 3a, 3b are baked. Thereafter' at least the conductor paste 8a of the baked sheet at the inner wall of the hole 7 at the side of the body 1 is plated at 11, the outer edge 2 is separated from the body 1. For example, a semiconductor element mount 4, an inner electrode 5 and an outer electrode 6 are formed of the conductor paste at predetermined forming positions of the sheets 3a, 3b.
JP22755687A 1987-09-12 1987-09-12 Manufacture of ceramic leadless package Granted JPS6472592A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22755687A JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22755687A JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Publications (2)

Publication Number Publication Date
JPS6472592A true JPS6472592A (en) 1989-03-17
JPH0529145B2 JPH0529145B2 (en) 1993-04-28

Family

ID=16862755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22755687A Granted JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Country Status (1)

Country Link
JP (1) JPS6472592A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084145A (en) * 1989-04-27 1992-01-28 Sumitomo Metal Industries, Ltd. Method for manufacturing one-sided electroplated steel sheet

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124794A (en) * 1982-12-29 1984-07-18 松下電器産業株式会社 Method of producing electronic circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124794A (en) * 1982-12-29 1984-07-18 松下電器産業株式会社 Method of producing electronic circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084145A (en) * 1989-04-27 1992-01-28 Sumitomo Metal Industries, Ltd. Method for manufacturing one-sided electroplated steel sheet

Also Published As

Publication number Publication date
JPH0529145B2 (en) 1993-04-28

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