JPS6472592A - Manufacture of ceramic leadless package - Google Patents
Manufacture of ceramic leadless packageInfo
- Publication number
- JPS6472592A JPS6472592A JP22755687A JP22755687A JPS6472592A JP S6472592 A JPS6472592 A JP S6472592A JP 22755687 A JP22755687 A JP 22755687A JP 22755687 A JP22755687 A JP 22755687A JP S6472592 A JPS6472592 A JP S6472592A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- outer edge
- conductor paste
- conductor
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22755687A JPS6472592A (en) | 1987-09-12 | 1987-09-12 | Manufacture of ceramic leadless package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22755687A JPS6472592A (en) | 1987-09-12 | 1987-09-12 | Manufacture of ceramic leadless package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6472592A true JPS6472592A (en) | 1989-03-17 |
| JPH0529145B2 JPH0529145B2 (ja) | 1993-04-28 |
Family
ID=16862755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22755687A Granted JPS6472592A (en) | 1987-09-12 | 1987-09-12 | Manufacture of ceramic leadless package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6472592A (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5084145A (en) * | 1989-04-27 | 1992-01-28 | Sumitomo Metal Industries, Ltd. | Method for manufacturing one-sided electroplated steel sheet |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124794A (ja) * | 1982-12-29 | 1984-07-18 | 松下電器産業株式会社 | 電子回路基板の製造方法 |
-
1987
- 1987-09-12 JP JP22755687A patent/JPS6472592A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124794A (ja) * | 1982-12-29 | 1984-07-18 | 松下電器産業株式会社 | 電子回路基板の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5084145A (en) * | 1989-04-27 | 1992-01-28 | Sumitomo Metal Industries, Ltd. | Method for manufacturing one-sided electroplated steel sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0529145B2 (ja) | 1993-04-28 |
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