JPS6472592A - Manufacture of ceramic leadless package - Google Patents

Manufacture of ceramic leadless package

Info

Publication number
JPS6472592A
JPS6472592A JP22755687A JP22755687A JPS6472592A JP S6472592 A JPS6472592 A JP S6472592A JP 22755687 A JP22755687 A JP 22755687A JP 22755687 A JP22755687 A JP 22755687A JP S6472592 A JPS6472592 A JP S6472592A
Authority
JP
Japan
Prior art keywords
hole
outer edge
conductor paste
conductor
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22755687A
Other languages
English (en)
Other versions
JPH0529145B2 (ja
Inventor
Takuji Yamamoto
Mutsumi Kitagawa
Kunimitsu Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Priority to JP22755687A priority Critical patent/JPS6472592A/ja
Publication of JPS6472592A publication Critical patent/JPS6472592A/ja
Publication of JPH0529145B2 publication Critical patent/JPH0529145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP22755687A 1987-09-12 1987-09-12 Manufacture of ceramic leadless package Granted JPS6472592A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22755687A JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22755687A JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Publications (2)

Publication Number Publication Date
JPS6472592A true JPS6472592A (en) 1989-03-17
JPH0529145B2 JPH0529145B2 (ja) 1993-04-28

Family

ID=16862755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22755687A Granted JPS6472592A (en) 1987-09-12 1987-09-12 Manufacture of ceramic leadless package

Country Status (1)

Country Link
JP (1) JPS6472592A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084145A (en) * 1989-04-27 1992-01-28 Sumitomo Metal Industries, Ltd. Method for manufacturing one-sided electroplated steel sheet

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124794A (ja) * 1982-12-29 1984-07-18 松下電器産業株式会社 電子回路基板の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124794A (ja) * 1982-12-29 1984-07-18 松下電器産業株式会社 電子回路基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5084145A (en) * 1989-04-27 1992-01-28 Sumitomo Metal Industries, Ltd. Method for manufacturing one-sided electroplated steel sheet

Also Published As

Publication number Publication date
JPH0529145B2 (ja) 1993-04-28

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