JPS647546A - Resin-sealed semiconductor device - Google Patents
Resin-sealed semiconductor deviceInfo
- Publication number
- JPS647546A JPS647546A JP16188087A JP16188087A JPS647546A JP S647546 A JPS647546 A JP S647546A JP 16188087 A JP16188087 A JP 16188087A JP 16188087 A JP16188087 A JP 16188087A JP S647546 A JPS647546 A JP S647546A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- protecting layer
- semiconductor element
- metal
- metal particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000002923 metal particle Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 2
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 229920002050 silicone resin Polymers 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To improve a semiconductor element in heat radiation by a method wherein a protecting layer is a resin film containing insulation-capable metal particles. CONSTITUTION:The surface of a semiconductor element 12, including leadout electrodes 13 and metal fine wires 14, is covered by a protecting layer 16. The protecting layer 16 is built for example of a silicone resin 16-1 containing particles 16-2 of metal such as aluminum. The metal particles 16-2 are covered by an insulating oxide film for example of aluminum oxide (Al2O3) or with an insulating resin film for example of an epoxy resin. With high-conduction metal particles 16-2 being added to a low-conduction resin 16-1, the protecting layer 16 may be improved in its heat conducting efficiency. This leads to a semiconductor element 12 provided with an enhanced heat-radiating capability.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16188087A JPS647546A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16188087A JPS647546A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS647546A true JPS647546A (en) | 1989-01-11 |
Family
ID=15743742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16188087A Pending JPS647546A (en) | 1987-06-29 | 1987-06-29 | Resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS647546A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096301A (en) * | 2001-09-25 | 2003-04-03 | Shin Etsu Chem Co Ltd | Silicone rubber composition for sealing electric / electronic parts |
| US20230137612A1 (en) * | 2021-11-03 | 2023-05-04 | Nexperia B.V. | Semiconductor package assembly and method of manufacturing |
-
1987
- 1987-06-29 JP JP16188087A patent/JPS647546A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096301A (en) * | 2001-09-25 | 2003-04-03 | Shin Etsu Chem Co Ltd | Silicone rubber composition for sealing electric / electronic parts |
| US20230137612A1 (en) * | 2021-11-03 | 2023-05-04 | Nexperia B.V. | Semiconductor package assembly and method of manufacturing |
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