JPS647599A - Detector for packaging of electronic component - Google Patents
Detector for packaging of electronic componentInfo
- Publication number
- JPS647599A JPS647599A JP62161042A JP16104287A JPS647599A JP S647599 A JPS647599 A JP S647599A JP 62161042 A JP62161042 A JP 62161042A JP 16104287 A JP16104287 A JP 16104287A JP S647599 A JPS647599 A JP S647599A
- Authority
- JP
- Japan
- Prior art keywords
- condensed
- light
- leads
- substrate
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 6
- 238000001514 detection method Methods 0.000 abstract 2
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
PURPOSE:To enable correct detection of packaging condition of electronic components correctly by irradiating substrate holes where leads are inserted with a condensed spot light and by detecting whether the leads are inserted in the substrate holes according to levels of reflected light, thereby performing the detection of mounted electronic components. CONSTITUTION:When a printed substrate 1 which is produced through a mounting process of electronic components is positioned at a supporting part 11, a laser beam L is irradiated by the semiconductor laser 16 of photosensors 12 and 12 which hold positions at lower parts of the supporting part 11. The laser beam L is condensed by a condenser lens 17 and a condensed spot light is formed at an irradiated part 18 in the vicinity of substrate holes 2 and 2. In such a case, if leads 5 and 5 are inserted in the substrate holes 2 and 2, in other words, if a coil 3 is mounted at the printed substrate 1, the condensed laser beam L is reflected by the lead 5. After reflected light have been condensed by a light receiving lens 19, the light is received by a photodetector 20. Thus, the presence or absence of the coil 5 is accurately detected by levels of the reflected light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62161042A JPS647599A (en) | 1987-06-30 | 1987-06-30 | Detector for packaging of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62161042A JPS647599A (en) | 1987-06-30 | 1987-06-30 | Detector for packaging of electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS647599A true JPS647599A (en) | 1989-01-11 |
Family
ID=15727492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62161042A Pending JPS647599A (en) | 1987-06-30 | 1987-06-30 | Detector for packaging of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS647599A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1297968A2 (en) | 2001-09-28 | 2003-04-02 | Fuji Photo Film Co., Ltd. | Dampening water composition for lithographic printing plate and lithographic printing process |
-
1987
- 1987-06-30 JP JP62161042A patent/JPS647599A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1297968A2 (en) | 2001-09-28 | 2003-04-02 | Fuji Photo Film Co., Ltd. | Dampening water composition for lithographic printing plate and lithographic printing process |
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