JPS6477143A - Formation of copper thin film wiring - Google Patents

Formation of copper thin film wiring

Info

Publication number: JPS6477143A
Authority: JP; Japan
Prior art keywords: film; copper thin; thin film; resist; grooves
Prior art date: 1987-09-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP23459487A

Other languages

English (en)

Inventor

Takashi Yoda

Katsuya Okumura

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Toshiba Corp

Original Assignee

Toshiba Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-18

Filing date

1987-09-18

Publication date

1989-03-23

1987-09-18 Application filed by Toshiba Corp filed Critical Toshiba Corp

1987-09-18 Priority to JP23459487A priority Critical patent/JPS6477143A/ja

1989-03-23 Publication of JPS6477143A publication Critical patent/JPS6477143A/ja

Status Pending legal-status Critical Current

Links

RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 5
229910052802 copper Inorganic materials 0.000 title abstract 5
239000010949 copper Substances 0.000 title abstract 5
239000010409 thin film Substances 0.000 title abstract 4
230000015572 biosynthetic process Effects 0.000 title 1
239000010408 film Substances 0.000 abstract 11
238000000034 method Methods 0.000 abstract 2
238000001755 magnetron sputter deposition Methods 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1

Landscapes

Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

JP23459487A 1987-09-18 1987-09-18 Formation of copper thin film wiring Pending JPS6477143A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP23459487A JPS6477143A (en)	1987-09-18	1987-09-18	Formation of copper thin film wiring

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP23459487A JPS6477143A (en)	1987-09-18	1987-09-18	Formation of copper thin film wiring

Publications (1)

Publication Number	Publication Date
JPS6477143A true JPS6477143A (en)	1989-03-23

Family

ID=16973475

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP23459487A Pending JPS6477143A (en)	1987-09-18	1987-09-18	Formation of copper thin film wiring

Country Status (1)

Country	Link
JP (1)	JPS6477143A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH05102318A (ja) *	1991-04-05	1993-04-23	Internatl Business Mach Corp <Ibm>	銅合金導電プラグ形成方法及び装置
JPH088302B2 (ja) *	1990-04-26	1996-01-29	インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン	多層配線における相互接続部およびその形成方法
KR100371691B1 (ko) *	2000-08-16	2003-02-06	정동근	저유전 플라스마 중합체 박막 및 이를 이용한 반도체 소자의 제조 방법
JP2007520079A (ja) *	2004-01-30	2007-07-19	ラム　リサーチ　コーポレーション	動的な液体メニスカスを用いたストレスフリーのエッチング処理

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63117446A (ja) *	1986-11-06	1988-05-21	Fujitsu Ltd	半導体装置の製造方法

1987
- 1987-09-18 JP JP23459487A patent/JPS6477143A/ja active Pending

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS63117446A (ja) *	1986-11-06	1988-05-21	Fujitsu Ltd	半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH088302B2 (ja) *	1990-04-26	1996-01-29	インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン	多層配線における相互接続部およびその形成方法
JPH05102318A (ja) *	1991-04-05	1993-04-23	Internatl Business Mach Corp <Ibm>	銅合金導電プラグ形成方法及び装置
KR100371691B1 (ko) *	2000-08-16	2003-02-06	정동근	저유전 플라스마 중합체 박막 및 이를 이용한 반도체 소자의 제조 방법
JP2007520079A (ja) *	2004-01-30	2007-07-19	ラム　リサーチ　コーポレーション	動的な液体メニスカスを用いたストレスフリーのエッチング処理

Similar Documents

Publication	Publication Date	Title
JPS54589A (en)	1979-01-05	Burying method of insulator
EP0304077A3 (en)	1990-07-18	Method of forming a fine pattern
JPS5352384A (en)	1978-05-12	Electrode formation method
JPS57145340A (en)	1982-09-08	Manufacture of semiconductor device
JPS5772333A (en)	1982-05-06	Manufacture of semiconductor device
JPS5484932A (en)	1979-07-06	Forming method of multi-layer construction
JPS5460582A (en)	1979-05-16	Electrode wiring and its forming method in semiconductor device
JPS5516433A (en)	1980-02-05	Method of forming multilayer distributing layer
JPS559415A (en)	1980-01-23	Semiconductor manufacturing method
JPS5527639A (en)	1980-02-27	Photo-resist pattern forming method
JPS57102014A (en)	1982-06-24	Manufacture of semiconductor device
JPS5219297A (en)	1977-02-14	Method of manufacturing a metal film resistor
JPS54149463A (en)	1979-11-22	Selective diffusion method aluminum
JPS5766521A (en)	1982-04-22	Thin-film magnetic head and its manufacture
JPS5732375A (en)	1982-02-22	Etching method for thin film
JPS6484224A (en)	1989-03-29	Electrode forming method
JPS5291193A (en)	1977-08-01	Forming method of conductor pattern
JPS5575241A (en)	1980-06-06	Method of fabricating semiconductor device
JPS6436049A (en)	1989-02-07	Semiconductor integrated circuit and manufacture thereof
JPS5512775A (en)	1980-01-29	Manufacturing method of semiconductor
JPS52100983A (en)	1977-08-24	Formation of conductive layer
JPS5711450A (en)	1982-01-21	Manufacture of fluorescent display tube
JPS5513964A (en)	1980-01-31	Method of manufacturing semiconductor device
JPS5612743A (en)	1981-02-07	Processing method of projection for conductive layer of substrate
JPS57201049A (en)	1982-12-09	Forming method of contacting hole for connecting wire between layers