JPS6480099A - Manufacture of flexible printed wiring substrate - Google Patents
Manufacture of flexible printed wiring substrateInfo
- Publication number
- JPS6480099A JPS6480099A JP23697887A JP23697887A JPS6480099A JP S6480099 A JPS6480099 A JP S6480099A JP 23697887 A JP23697887 A JP 23697887A JP 23697887 A JP23697887 A JP 23697887A JP S6480099 A JPS6480099 A JP S6480099A
- Authority
- JP
- Japan
- Prior art keywords
- polyimide film
- printed wiring
- wiring substrate
- coupling agent
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 229920001721 polyimide Polymers 0.000 abstract 4
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000003851 corona treatment Methods 0.000 abstract 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To eliminate roller stains caused by fine cracks during a coating process by a method wherein a polyimide film is made to be used, whose surface is previously subjected to a corona treatment and then treated with a silane coupling agent. CONSTITUTION:A polyimide film and a metal foil are laminated through an adhesive so as to form a flexible printed wiring substrate. In this process, the surface of the polyimide film is previously made to be subjected to a corona treatment and then treated by using a silane coupling agent. Then, a silane coupling agent adheres to both the polyimide film and the adhesive at the interface between them, so that a strong bonding can be accomplished. By these processes, roller stains caused by fine cracks during a coating process is eliminated, so that a printed wiring substrate of this design can be prevented from decreasing in a voltage with standing property.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23697887A JPS6480099A (en) | 1987-09-21 | 1987-09-21 | Manufacture of flexible printed wiring substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23697887A JPS6480099A (en) | 1987-09-21 | 1987-09-21 | Manufacture of flexible printed wiring substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6480099A true JPS6480099A (en) | 1989-03-24 |
Family
ID=17008580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23697887A Pending JPS6480099A (en) | 1987-09-21 | 1987-09-21 | Manufacture of flexible printed wiring substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6480099A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5647939A (en) * | 1994-12-05 | 1997-07-15 | Integrated Liner Technologies, Inc. | Method of bonding a cured elastomer to plastic and metal surfaces |
| US5922161A (en) * | 1995-06-30 | 1999-07-13 | Commonwealth Scientific And Industrial Research Organisation | Surface treatment of polymers |
| JP2006245303A (en) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | Surface treatment method of copper foil |
| JP2007098791A (en) * | 2005-10-05 | 2007-04-19 | Shin Etsu Chem Co Ltd | Flexible single-sided copper-clad polyimide laminate |
| JP2008160151A (en) * | 2008-02-18 | 2008-07-10 | Arisawa Mfg Co Ltd | Flexible printed wiring board, multilayer flexible printed wiring board, and mobile phone terminal using the multilayer flexible printed wiring board |
| US8383230B2 (en) | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
-
1987
- 1987-09-21 JP JP23697887A patent/JPS6480099A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5647939A (en) * | 1994-12-05 | 1997-07-15 | Integrated Liner Technologies, Inc. | Method of bonding a cured elastomer to plastic and metal surfaces |
| US6234335B1 (en) | 1994-12-05 | 2001-05-22 | Integrated Liner Technologies Inc. | Sealable container and open top cap with directly bonded elastomer septum |
| US5922161A (en) * | 1995-06-30 | 1999-07-13 | Commonwealth Scientific And Industrial Research Organisation | Surface treatment of polymers |
| JP2006245303A (en) * | 2005-03-03 | 2006-09-14 | Nikko Kinzoku Kk | Surface treatment method of copper foil |
| JP2007098791A (en) * | 2005-10-05 | 2007-04-19 | Shin Etsu Chem Co Ltd | Flexible single-sided copper-clad polyimide laminate |
| US8383230B2 (en) | 2007-05-24 | 2013-02-26 | Arisawa Mfg. Co., Ltd. | Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board |
| JP2008160151A (en) * | 2008-02-18 | 2008-07-10 | Arisawa Mfg Co Ltd | Flexible printed wiring board, multilayer flexible printed wiring board, and mobile phone terminal using the multilayer flexible printed wiring board |
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