JPS6480099A - Manufacture of flexible printed wiring substrate - Google Patents

Manufacture of flexible printed wiring substrate

Info

Publication number: JPS6480099A
Authority: JP; Japan
Prior art keywords: polyimide film; printed wiring; wiring substrate; coupling agent; silane coupling
Prior art date: 1987-09-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP23697887A

Other languages

English (en)

Inventor

Takao Sugawara

Yutaka Yamaguchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-09-21

Filing date

1987-09-21

Publication date

1989-03-24

1987-09-21 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

1987-09-21 Priority to JP23697887A priority Critical patent/JPS6480099A/ja

1989-03-24 Publication of JPS6480099A publication Critical patent/JPS6480099A/ja

Status Pending legal-status Critical Current

Links

239000000758 substrate Substances 0.000 title abstract 3
238000004519 manufacturing process Methods 0.000 title 1
229920001721 polyimide Polymers 0.000 abstract 4
239000006087 Silane Coupling Agent Substances 0.000 abstract 3
238000000034 method Methods 0.000 abstract 3
239000000853 adhesive Substances 0.000 abstract 2
230000001070 adhesive effect Effects 0.000 abstract 2
238000000576 coating method Methods 0.000 abstract 2
238000003851 corona treatment Methods 0.000 abstract 2
230000003247 decreasing effect Effects 0.000 abstract 1
239000011888 foil Substances 0.000 abstract 1
239000002184 metal Substances 0.000 abstract 1

Landscapes

Treatments Of Macromolecular Shaped Articles (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)

JP23697887A 1987-09-21 1987-09-21 Manufacture of flexible printed wiring substrate Pending JPS6480099A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP23697887A JPS6480099A (en)	1987-09-21	1987-09-21	Manufacture of flexible printed wiring substrate

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP23697887A JPS6480099A (en)	1987-09-21	1987-09-21	Manufacture of flexible printed wiring substrate

Publications (1)

Publication Number	Publication Date
JPS6480099A true JPS6480099A (en)	1989-03-24

Family

ID=17008580

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP23697887A Pending JPS6480099A (en)	1987-09-21	1987-09-21	Manufacture of flexible printed wiring substrate

Country Status (1)

Country	Link
JP (1)	JPS6480099A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5647939A (en) *	1994-12-05	1997-07-15	Integrated Liner Technologies, Inc.	Method of bonding a cured elastomer to plastic and metal surfaces
US5922161A (en) *	1995-06-30	1999-07-13	Commonwealth Scientific And Industrial Research Organisation	Surface treatment of polymers
JP2006245303A (ja) *	2005-03-03	2006-09-14	Nikko Kinzoku Kk	銅箔の表面処理方法
JP2007098791A (ja) *	2005-10-05	2007-04-19	Shin Etsu Chem Co Ltd	フレキシブル片面銅張ポリイミド積層板
JP2008160151A (ja) *	2008-02-18	2008-07-10	Arisawa Mfg Co Ltd	フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末
US8383230B2 (en)	2007-05-24	2013-02-26	Arisawa Mfg. Co., Ltd.	Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board

1987
- 1987-09-21 JP JP23697887A patent/JPS6480099A/ja active Pending

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5647939A (en) *	1994-12-05	1997-07-15	Integrated Liner Technologies, Inc.	Method of bonding a cured elastomer to plastic and metal surfaces
US6234335B1 (en)	1994-12-05	2001-05-22	Integrated Liner Technologies Inc.	Sealable container and open top cap with directly bonded elastomer septum
US5922161A (en) *	1995-06-30	1999-07-13	Commonwealth Scientific And Industrial Research Organisation	Surface treatment of polymers
JP2006245303A (ja) *	2005-03-03	2006-09-14	Nikko Kinzoku Kk	銅箔の表面処理方法
JP2007098791A (ja) *	2005-10-05	2007-04-19	Shin Etsu Chem Co Ltd	フレキシブル片面銅張ポリイミド積層板
US8383230B2 (en)	2007-05-24	2013-02-26	Arisawa Mfg. Co., Ltd.	Flexible printed wiring board, multilayered flexible printed wiring board, and mobile telephone terminal employing multilayered flexible printed wiring board
JP2008160151A (ja) *	2008-02-18	2008-07-10	Arisawa Mfg Co Ltd	フレキシブルプリント配線板及び多層フレキシブルプリント配線板、前記多層フレキシブルプリント配線板を用いた携帯電話端末

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