JPS6481336A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6481336A
JPS6481336A JP24001287A JP24001287A JPS6481336A JP S6481336 A JPS6481336 A JP S6481336A JP 24001287 A JP24001287 A JP 24001287A JP 24001287 A JP24001287 A JP 24001287A JP S6481336 A JPS6481336 A JP S6481336A
Authority
JP
Japan
Prior art keywords
sheet
face
pattern
cutting
pellets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24001287A
Other languages
Japanese (ja)
Inventor
Satoshi Takahashi
Takumi Matsukura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24001287A priority Critical patent/JPS6481336A/en
Publication of JPS6481336A publication Critical patent/JPS6481336A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To eliminate the contaminant on the face of a pattern at the stage of dicing and to complete mounting on an island in a short time by including a step of cutting a semiconductor wafer from its rear side with a pattern forming face disposed at its lower side and a pellet dividing step of adhering the pattern forming face on a sheet to elongate it. CONSTITUTION:A semiconductor wafer 1 is attracted and fixed at its pattern face 2 to an attracting table 4, and diced by a cutting grindstone 8 rotating at a high speed from its rear face 3. In this case, cooling water 6 is injected from an injection nozzle 5 to wash cutting chips 7 generated at the time of cutting. Then, the diced wafer 1 is processed through various steps of adhering it with a sheet, enlarging the sheet by braking, and pellets 10 are adhered and arrayed at an equal interval on the sheet 9 with their rear faces 3 directed upward and with their pattern faces 2 directed downward. The pellets 10 are pressed on the islands 13 of a lead frame 12 disposed directly under a mounting arm 11 from above the sheet 9, and sequentially mounted rapidly.
JP24001287A 1987-09-24 1987-09-24 Manufacture of semiconductor device Pending JPS6481336A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24001287A JPS6481336A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24001287A JPS6481336A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6481336A true JPS6481336A (en) 1989-03-27

Family

ID=17053149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24001287A Pending JPS6481336A (en) 1987-09-24 1987-09-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6481336A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19822512A1 (en) * 1998-05-19 1999-10-21 Siemens Ag Semiconductor element separation and positioning method
US5991598A (en) * 1993-06-30 1999-11-23 Nec Corporation Burst signal transmission from an earth station to an orbiting satellite with a short guard time
DE10121578A1 (en) * 2001-05-03 2002-11-14 Infineon Technologies Ag Method and assembly system for assembling a substrate with electronic components

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991598A (en) * 1993-06-30 1999-11-23 Nec Corporation Burst signal transmission from an earth station to an orbiting satellite with a short guard time
DE19822512A1 (en) * 1998-05-19 1999-10-21 Siemens Ag Semiconductor element separation and positioning method
DE10121578A1 (en) * 2001-05-03 2002-11-14 Infineon Technologies Ag Method and assembly system for assembling a substrate with electronic components
DE10121578C2 (en) * 2001-05-03 2003-04-10 Infineon Technologies Ag Method and assembly system for assembling a substrate with electronic components
US7069647B2 (en) 2001-05-03 2006-07-04 Infineon Technologies Ag Method for populating a substrate with electronic components
US7500305B2 (en) 2001-05-03 2009-03-10 Qimonda Ag Placement system for populating a substrate with electronic components

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