JPS648260A - Formation of composite metal-ceramics film - Google Patents

Formation of composite metal-ceramics film

Info

Publication number
JPS648260A
JPS648260A JP62102941A JP10294187A JPS648260A JP S648260 A JPS648260 A JP S648260A JP 62102941 A JP62102941 A JP 62102941A JP 10294187 A JP10294187 A JP 10294187A JP S648260 A JPS648260 A JP S648260A
Authority
JP
Japan
Prior art keywords
powder
film
ceramics
thermal spraying
contg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62102941A
Other languages
Japanese (ja)
Other versions
JPH0543781B2 (en
Inventor
Tokuzo Kanbe
Yaozo Kumagai
Yuzuru Horie
Hiroshi Niwa
Takashi Isobe
Atsushi Misaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maruyasu Industries Co Ltd
National Institute of Advanced Industrial Science and Technology AIST
Shimane Prefecture
Original Assignee
Agency of Industrial Science and Technology
Maruyasu Industries Co Ltd
Shimane Prefecture
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology, Maruyasu Industries Co Ltd, Shimane Prefecture filed Critical Agency of Industrial Science and Technology
Priority to JP62102941A priority Critical patent/JPS648260A/en
Publication of JPS648260A publication Critical patent/JPS648260A/en
Publication of JPH0543781B2 publication Critical patent/JPH0543781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Chemically Coating (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

PURPOSE:To form a composite metal-ceramics film having a good electrical function on a base body by subjecting ceramics powder the surface of which is treated with an epoxy resin to surface activation using a silver ion-contg. liquid and subjecting this powder to electroless plating, then using the powder formed in such a manner as a thermal spraying material. CONSTITUTION:The epoxy resin is coated together with a hardener on the ceramics powder of sericite, etc., to impart a heavy metal capturing property thereto. The powder is then immersed in a soln. contg. silver ions such as silver nitrate to activate the powder surface and, thereafter, the powder is immersed in an electroless plating liquid contg. copper, etc., to form a metal film on the powder surface. Such power is used as the thermal spraying material and the composite metal-ceramics film is formed on the surface of the base body by plasma thermal spraying, gas type thermal spraying, etc. This composite film is applicable to a conductive circuit board, high-frequency induction heating film, panel heating element, etc.
JP62102941A 1986-08-08 1987-04-24 Formation of composite metal-ceramics film Granted JPS648260A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62102941A JPS648260A (en) 1986-08-08 1987-04-24 Formation of composite metal-ceramics film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18729086 1986-08-08
JP62102941A JPS648260A (en) 1986-08-08 1987-04-24 Formation of composite metal-ceramics film

Publications (2)

Publication Number Publication Date
JPS648260A true JPS648260A (en) 1989-01-12
JPH0543781B2 JPH0543781B2 (en) 1993-07-02

Family

ID=16203409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62102941A Granted JPS648260A (en) 1986-08-08 1987-04-24 Formation of composite metal-ceramics film

Country Status (1)

Country Link
JP (1) JPS648260A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002348673A (en) * 2001-05-24 2002-12-04 Learonal Japan Inc Electroless copper plating method using no formaldehyde and electroless copper plating solution used in the method
WO2011096231A1 (en) * 2010-02-05 2011-08-11 日鉄ハード株式会社 Thermal spray material and method for forming a sprayed coating

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233054A (en) * 1975-09-10 1977-03-12 Toshiba Corp Lightening rod
JPS59182961A (en) * 1983-03-31 1984-10-17 Agency Of Ind Science & Technol Production of inorganic powder having metallic film
JPS59208064A (en) * 1983-05-11 1984-11-26 Mitsubishi Electric Corp Powder for flame spraying

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233054A (en) * 1975-09-10 1977-03-12 Toshiba Corp Lightening rod
JPS59182961A (en) * 1983-03-31 1984-10-17 Agency Of Ind Science & Technol Production of inorganic powder having metallic film
JPS59208064A (en) * 1983-05-11 1984-11-26 Mitsubishi Electric Corp Powder for flame spraying

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002348673A (en) * 2001-05-24 2002-12-04 Learonal Japan Inc Electroless copper plating method using no formaldehyde and electroless copper plating solution used in the method
WO2011096231A1 (en) * 2010-02-05 2011-08-11 日鉄ハード株式会社 Thermal spray material and method for forming a sprayed coating

Also Published As

Publication number Publication date
JPH0543781B2 (en) 1993-07-02

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