JPS6484782A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPS6484782A JPS6484782A JP24325087A JP24325087A JPS6484782A JP S6484782 A JPS6484782 A JP S6484782A JP 24325087 A JP24325087 A JP 24325087A JP 24325087 A JP24325087 A JP 24325087A JP S6484782 A JPS6484782 A JP S6484782A
- Authority
- JP
- Japan
- Prior art keywords
- outer shape
- insulating layer
- processed
- whose outer
- part whose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
PURPOSE:To prevent a crack and a exfoliation during an operation to process an outer shape by a method wherein an insulating layer to be coated on the surface of a conductor circuit including a part whose outer shape is to be processed is formed with a specific thickness at the part whose outer shape is to be processed as compared with a part other than the part whose outer shape is to be processed. CONSTITUTION:A first insulating layer 11 is formed on a plastic substrate 10 by a screen printing method and is hardened at a prescribed temperature and for a prescribed duration. A hardening operation in this case is not required to be a perfect hardening operation; it is sufficient to reach a B stage capable of making the layer dry when the layer is touched with a finger. Then, a second insulating layer 12 is formed in the same manner as the first insulating layer 11 by the screen printing method and is hardened at a prescribed temperature and for a prescribed duration. In this case, the layer is hardened completely. A printed wiring board is obtained in such a way that the insulating layers covering the surface of a conductor circuit including a part whose outer shape is to be processed are formed with a thickness of one-third to three-fourths as compared with a part excluding the part whose outer shape is to be processed and that it is possible to surely prevent a crack and an exfoliation to be caused during an operation to process the outer shape. In addition, because the second insulating layer is formed by covering the first insulating layer, this circuit board becomes a structure where the exfoliation between the layers is hardly caused even when various stress strains are caused between the insulating layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325087A JPS6484782A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325087A JPS6484782A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6484782A true JPS6484782A (en) | 1989-03-30 |
Family
ID=17101074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24325087A Pending JPS6484782A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484782A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298795A (en) * | 1985-10-25 | 1987-05-08 | 日本シイエムケイ株式会社 | Printed wiring board and manufacture of the same |
-
1987
- 1987-09-28 JP JP24325087A patent/JPS6484782A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298795A (en) * | 1985-10-25 | 1987-05-08 | 日本シイエムケイ株式会社 | Printed wiring board and manufacture of the same |
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