JPS6485271A - Printed board - Google Patents

Printed board

Info

Publication number
JPS6485271A
JPS6485271A JP20382988A JP20382988A JPS6485271A JP S6485271 A JPS6485271 A JP S6485271A JP 20382988 A JP20382988 A JP 20382988A JP 20382988 A JP20382988 A JP 20382988A JP S6485271 A JPS6485271 A JP S6485271A
Authority
JP
Japan
Prior art keywords
heat
give
weight ratio
plastic film
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20382988A
Other languages
Japanese (ja)
Other versions
JPH0517269B2 (en
Inventor
Toshikazu Furuhata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP57196782A external-priority patent/JPS5989380A/en
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP20382988A priority Critical patent/JPS6485271A/en
Publication of JPS6485271A publication Critical patent/JPS6485271A/en
Publication of JPH0517269B2 publication Critical patent/JPH0517269B2/ja
Granted legal-status Critical Current

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Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To obtain the title board excellent in adhesiveness, electrical properties, soldering-heat resistance and chemical resistance, by bonding a heat- resistant plastic film to a metallic foil with a specified adhesive composition. CONSTITUTION:An adhesive composition (C) is obtained by mixing a poly-N- glycidyl epoxy resin (a) of the formula (wherein n is 1-6), obtained from an amine and an epihalohydrin, with COOH (1-8wt.%)-containing nitrile rubber (b) in an amount to give a weight ratio: 0.05<=a/b<=2.0 and fine silica powder and/or clay treated with an onium salt (c) (e.g., montomorillonite treated with a trialkylarylammonium) in an amount to give a weight ratio in the range of 0.01<=c/(a+b)<=0.8. A solution prepared by dissolving component C and a curing agent (cure accelerator) in a solvent is applied between a heat-resistant plastic film (A) and a metallic foil (B), the components (A) and (B) are bonded together by application of a pressure, and the adhesive is post-cured optionally at 100-350 deg.C.
JP20382988A 1982-11-11 1988-08-18 Printed board Granted JPS6485271A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20382988A JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP57196782A JPS5989380A (en) 1982-11-11 1982-11-11 Adhesive composition
JP20382988A JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Publications (2)

Publication Number Publication Date
JPS6485271A true JPS6485271A (en) 1989-03-30
JPH0517269B2 JPH0517269B2 (en) 1993-03-08

Family

ID=26509975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20382988A Granted JPS6485271A (en) 1982-11-11 1988-08-18 Printed board

Country Status (1)

Country Link
JP (1) JPS6485271A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054509A (en) * 1997-08-28 2000-04-25 Shin-Etsu Chemical Co., Ltd. Adhesive of epoxy resin, nitrile rubbers and curing agent

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105622548A (en) * 2016-01-29 2016-06-01 合肥工业大学 High-temperature-resistant glycidyl amine type multifunctional epoxy resin and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS56135579A (en) * 1980-03-26 1981-10-23 Nitto Electric Ind Co Ltd Bondable resin molded article

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS56135579A (en) * 1980-03-26 1981-10-23 Nitto Electric Ind Co Ltd Bondable resin molded article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054509A (en) * 1997-08-28 2000-04-25 Shin-Etsu Chemical Co., Ltd. Adhesive of epoxy resin, nitrile rubbers and curing agent

Also Published As

Publication number Publication date
JPH0517269B2 (en) 1993-03-08

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