JPS648630U - - Google Patents

Info

Publication number
JPS648630U
JPS648630U JP10174087U JP10174087U JPS648630U JP S648630 U JPS648630 U JP S648630U JP 10174087 U JP10174087 U JP 10174087U JP 10174087 U JP10174087 U JP 10174087U JP S648630 U JPS648630 U JP S648630U
Authority
JP
Japan
Prior art keywords
heat
amplifier
pipe
pair
resistance wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10174087U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10174087U priority Critical patent/JPS648630U/ja
Publication of JPS648630U publication Critical patent/JPS648630U/ja
Pending legal-status Critical Current

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  • Measuring Volume Flow (AREA)

Description

【図面の簡単な説明】
第１図は本案の測定原理の説明図、第２図は従
来の測定原理の説明図、第３図、第４図は本案の
開発段階での、測定方法の説明図、第５図は第１
図の温度分布図、第６図は第３図の温度分布図、
第７図は第４図の温度分布図である。 １……パイプ、２，４……熱抵抗線、３……ヒ
ータ、５……ヒータ電源、６……ブリツジ回路電
源、７，８……抵抗、９……アンプ、１０……メ
ータ、１１……包囲体、１２……ブリツジ回路、
Ａ……ヒータ３から熱抵抗線４までの長さ、Ｂ…
…ヒータ３から熱抵抗線２までの長さ、Ｔａ……
熱抵抗線４の温度、Ｔｂ……熱抵抗線２の温度、
Ｔｈ……ヒータ３の温度。

Claims (1)

    【実用新案登録請求の範囲】
  1. 被測定流体を流通せしめるパイプの、外周面に
    、一対の感熱抵抗線を巻回する事により、形成さ
    れるブリツジ回路と、上記の一対の感熱抵抗線を
    外気と継熱する包囲体と、ブリツジ回路の不平衡
    を増幅するアンプと、アンプ出力を表示するメー
    タより成る流量計において、上記パイプに熱を供
    給するヒータを設けた事を特徴とする流量計。
JP10174087U 1987-07-03 1987-07-03 Pending JPS648630U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10174087U JPS648630U (ja) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10174087U JPS648630U (ja) 1987-07-03 1987-07-03

Publications (1)

Publication Number Publication Date
JPS648630U true JPS648630U (ja) 1989-01-18

Family

ID=31331012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10174087U Pending JPS648630U (ja) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPS648630U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7264680B2 (en) 1997-05-09 2007-09-04 Semitool, Inc. Process and apparatus for treating a workpiece using ozone
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7264680B2 (en) 1997-05-09 2007-09-04 Semitool, Inc. Process and apparatus for treating a workpiece using ozone
US7378355B2 (en) 1997-05-09 2008-05-27 Semitool, Inc. System and methods for polishing a wafer
US7404863B2 (en) 1997-05-09 2008-07-29 Semitool, Inc. Methods of thinning a silicon wafer using HF and ozone

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