JPS648698A - Manufacture of circuit board - Google Patents
Manufacture of circuit boardInfo
- Publication number
- JPS648698A JPS648698A JP16371787A JP16371787A JPS648698A JP S648698 A JPS648698 A JP S648698A JP 16371787 A JP16371787 A JP 16371787A JP 16371787 A JP16371787 A JP 16371787A JP S648698 A JPS648698 A JP S648698A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molecular weight
- parts
- coating film
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 6
- 229920000647 polyepoxide Polymers 0.000 abstract 6
- 239000000853 adhesive Substances 0.000 abstract 5
- 230000001070 adhesive effect Effects 0.000 abstract 5
- 239000011248 coating agent Substances 0.000 abstract 3
- 238000000576 coating method Methods 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 239000004640 Melamine resin Substances 0.000 abstract 2
- 229920000877 Melamine resin Polymers 0.000 abstract 2
- 230000029936 alkylation Effects 0.000 abstract 2
- 238000005804 alkylation reaction Methods 0.000 abstract 2
- 229920001225 polyester resin Polymers 0.000 abstract 2
- 239000004645 polyester resin Substances 0.000 abstract 2
- 229920006395 saturated elastomer Polymers 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 1
- 238000004132 cross linking Methods 0.000 abstract 1
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 229920001971 elastomer Polymers 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To wire in high density and to obtain a multiwiring substrate having excellent insulation at high temperatures by using a composition containing epoxy resin having specific ratio of epoxy resin including 5000 or more of molecular weight and epoxy resin including 5000 or less of molecular weight as an adhesive coating film for bonding insulated wire to an insulating substrate, alkylation melamine resin, saturated polyester resin, and crosslinking agent. CONSTITUTION:In a manufacture of a circuit board for forming a desired wiring pattern by forming an adhesive coating film on an insulating substrate, laying insulated wire on the film and simultaneously bonding it, a composition containing (a) epoxy resin having 5000 or more of molecular weight, (b) 100 parts of epoxy resin having 10:90-90:10 of epoxy resin having 5000 or less of molecular weight as the adhesive coating film, (c) 2-80 parts of alkylation melamine resin, (d) 5-50 parts of saturated polyester resin, and (e) 0.1-50 parts of crosslinking catalyst. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16371787A JPS648698A (en) | 1987-06-30 | 1987-06-30 | Manufacture of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16371787A JPS648698A (en) | 1987-06-30 | 1987-06-30 | Manufacture of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648698A true JPS648698A (en) | 1989-01-12 |
Family
ID=15779307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16371787A Pending JPS648698A (en) | 1987-06-30 | 1987-06-30 | Manufacture of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648698A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6436554B2 (en) | 1996-03-07 | 2002-08-20 | Mitsubishi Denki Kabushiki Kaisha | Method for producing Nb-Sn compound superconducting wire precursor and wire |
| JP2018530661A (en) * | 2015-09-15 | 2018-10-18 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesive composition and articles made from the adhesive |
-
1987
- 1987-06-30 JP JP16371787A patent/JPS648698A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6436554B2 (en) | 1996-03-07 | 2002-08-20 | Mitsubishi Denki Kabushiki Kaisha | Method for producing Nb-Sn compound superconducting wire precursor and wire |
| JP2018530661A (en) * | 2015-09-15 | 2018-10-18 | スリーエム イノベイティブ プロパティズ カンパニー | Adhesive composition and articles made from the adhesive |
| US10392540B2 (en) | 2015-09-15 | 2019-08-27 | 3M Innovative Properties Company | Adhesive composition and an article manufactured therefrom |
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