JPS648696A - Manufacture of circuit board - Google Patents

Manufacture of circuit board

Info

Publication number
JPS648696A
JPS648696A JP16371587A JP16371587A JPS648696A JP S648696 A JPS648696 A JP S648696A JP 16371587 A JP16371587 A JP 16371587A JP 16371587 A JP16371587 A JP 16371587A JP S648696 A JPS648696 A JP S648696A
Authority
JP
Japan
Prior art keywords
coating film
adhesive
adhesive coating
circuit board
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16371587A
Other languages
Japanese (ja)
Inventor
Shigeharu Ariga
Naoki Fukutomi
Hiroshi Takahashi
Yorio Iwasaki
Fujio Kojima
Hidehiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16371587A priority Critical patent/JPS648696A/en
Publication of JPS648696A publication Critical patent/JPS648696A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To wire in high density and to obtain a multiwiring substrate having excellent insulation at high temperatures by using a composition containing epoxy resin as an adhesive coating film for bonding insulated wire to an insulating substrate, alkylation melamine resin and glass short fiber. CONSTITUTION:In a manufacture of a circuit board for forming a desired wiring pattern by forming an adhesive coating film on an insulating substrate, laying insulated wire on the film and simultaneously bonding it, a composition containing (a) epoxy resin having 5000 or more of molecular weight as the adhesive coating film, (b) alkylation melamine resin, and (c) glass short fiber having 3-10mum of diameter, 50-300mum of length is used. When this adhesive is used, wiring property is improved as compared with a conventional rubber adhesive, and its heat resistance and electrical characteristics are largely improved.
JP16371587A 1987-06-30 1987-06-30 Manufacture of circuit board Pending JPS648696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16371587A JPS648696A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16371587A JPS648696A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Publications (1)

Publication Number Publication Date
JPS648696A true JPS648696A (en) 1989-01-12

Family

ID=15779264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16371587A Pending JPS648696A (en) 1987-06-30 1987-06-30 Manufacture of circuit board

Country Status (1)

Country Link
JP (1) JPS648696A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5103107A (en) * 1989-12-05 1992-04-07 Mitsubishi Denki K.K. Starter motor
US5130560A (en) * 1989-09-09 1992-07-14 Mitsubishi Denki K. K. Engine starter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130560A (en) * 1989-09-09 1992-07-14 Mitsubishi Denki K. K. Engine starter
US5103107A (en) * 1989-12-05 1992-04-07 Mitsubishi Denki K.K. Starter motor

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