JPS648805U - - Google Patents

Info

Publication number
JPS648805U
JPS648805U JP10397587U JP10397587U JPS648805U JP S648805 U JPS648805 U JP S648805U JP 10397587 U JP10397587 U JP 10397587U JP 10397587 U JP10397587 U JP 10397587U JP S648805 U JPS648805 U JP S648805U
Authority
JP
Japan
Prior art keywords
hole
path
conductor
integrated circuit
microwave integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10397587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10397587U priority Critical patent/JPS648805U/ja
Publication of JPS648805U publication Critical patent/JPS648805U/ja
Pending legal-status Critical Current

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  • Waveguides (AREA)
  • Microwave Amplifiers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のMICの1実施例の簡略平面
図、第2図は第1図中の―部分の拡大断面図
である。第3図は従来のMICの簡略平面図であ
る。 1……基板、2,3,4……第1、第2、第3
の導体路、5……接地パターン、6……半導体素
子(チツプ)、10a〜10f……スルーホール
、12……分割路。
FIG. 1 is a simplified plan view of one embodiment of the MIC of the present invention, and FIG. 2 is an enlarged cross-sectional view of the portion indicated by - in FIG. FIG. 3 is a simplified plan view of a conventional MIC. 1...Substrate, 2, 3, 4...1st, 2nd, 3rd
5...Grounding pattern, 6...Semiconductor element (chip), 10a to 10f...Through hole, 12...Dividing path.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 誘電体よりなる基板の一面に、第1、第2、第
3の導体路を配設すると共に之等各導電体路に個
別に接続される3個の電極を有する半導体素子を
設置し、前記基板の他面に、前記第3の導体路に
スルーホールを介して接続される接地パターンを
配設してなるマイクロ波集積回路において、前記
スルーホールは前記第3の導体路に沿つて複数個
設けられており、前記第3の導体路はスルーホー
ル上或いは隣接するスルーホール間に横断する分
割路によつて分断されていることを特徴とするマ
イクロ波集積回路。
A semiconductor element having first, second, and third conductor paths arranged on one surface of a substrate made of a dielectric material and having three electrodes individually connected to each of the conductor paths; In a microwave integrated circuit comprising a ground pattern connected to the third conductor path via a through hole on the other surface of the substrate, the through hole is arranged in plurality along the third conductor path. A microwave integrated circuit, wherein the third conductive path is separated by a dividing path that crosses over the through hole or between adjacent through holes.
JP10397587U 1987-07-07 1987-07-07 Pending JPS648805U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10397587U JPS648805U (en) 1987-07-07 1987-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10397587U JPS648805U (en) 1987-07-07 1987-07-07

Publications (1)

Publication Number Publication Date
JPS648805U true JPS648805U (en) 1989-01-18

Family

ID=31335281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10397587U Pending JPS648805U (en) 1987-07-07 1987-07-07

Country Status (1)

Country Link
JP (1) JPS648805U (en)

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