JPS649226A - Polyimide and heat-resistant adhesive comprising same - Google Patents

Polyimide and heat-resistant adhesive comprising same

Info

Publication number
JPS649226A
JPS649226A JP16394087A JP16394087A JPS649226A JP S649226 A JPS649226 A JP S649226A JP 16394087 A JP16394087 A JP 16394087A JP 16394087 A JP16394087 A JP 16394087A JP S649226 A JPS649226 A JP S649226A
Authority
JP
Japan
Prior art keywords
polyimide
group
aromatic group
polycyclic aromatic
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16394087A
Other languages
Japanese (ja)
Other versions
JP2535545B2 (en
Inventor
Masaji Tamai
Masahiro Ota
Saburo Kawashima
Katsuaki Iiyama
Hideaki Oikawa
Teruhiro Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP62163940A priority Critical patent/JP2535545B2/en
Priority to US07/210,789 priority patent/US4931531A/en
Priority to DE8888305831T priority patent/DE3866800D1/en
Priority to EP88305831A priority patent/EP0297808B1/en
Priority to AU18565/88A priority patent/AU586955B2/en
Priority to KR1019880008219A priority patent/KR910008325B1/en
Publication of JPS649226A publication Critical patent/JPS649226A/en
Application granted granted Critical
Publication of JP2535545B2 publication Critical patent/JP2535545B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE:To obtain a polyimide having excellent processability as well as excellent heat resistance inherent in polyimide, having a low water absorptivity and good transparency and being useful as a heat-resistant adhesive, comprising a specified ether diamine and a tetracarboxylic acid dianhydride. CONSTITUTION:This polyimide has repeating units of formula I (wherein R is a tetravalent group selected from among a 2C or higher aliphatic group, a cycloaliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group and an noncondensed polycyclic aromatic group and a noncondensed polycyclic aromatic group composed of aromatic groups bonded together directly or through bridging members). Said polyimide can be obtained by effecting ring closure through dehydration of a polyamic acid obtained by polymerizing an ether diamine of formula II, namely, bis[4-{4-(4-aminophenoxy) phenoxy}phenyl]sulfone with at least one tetracarboxylic acid dianhydride.
JP62163940A 1987-07-02 1987-07-02 Polyimide and heat-resistant adhesive made of polyimide Expired - Fee Related JP2535545B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP62163940A JP2535545B2 (en) 1987-07-02 1987-07-02 Polyimide and heat-resistant adhesive made of polyimide
US07/210,789 US4931531A (en) 1987-07-02 1988-06-24 Polyimide and high-temperature adhesive thereof
DE8888305831T DE3866800D1 (en) 1987-07-02 1988-06-27 POLYIMIDE AND HIGH TEMPERATURE ADHESIVE THEREOF.
EP88305831A EP0297808B1 (en) 1987-07-02 1988-06-27 Polyimide and high-temperature adhesive thereof
AU18565/88A AU586955B2 (en) 1987-07-02 1988-06-30 Polyimide and high-temperature adhesive thereof
KR1019880008219A KR910008325B1 (en) 1987-07-02 1988-07-02 Heat-resistant adhesive composed of polyimide and polyimide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62163940A JP2535545B2 (en) 1987-07-02 1987-07-02 Polyimide and heat-resistant adhesive made of polyimide

Publications (2)

Publication Number Publication Date
JPS649226A true JPS649226A (en) 1989-01-12
JP2535545B2 JP2535545B2 (en) 1996-09-18

Family

ID=15783712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62163940A Expired - Fee Related JP2535545B2 (en) 1987-07-02 1987-07-02 Polyimide and heat-resistant adhesive made of polyimide

Country Status (1)

Country Link
JP (1) JP2535545B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
JP2008031406A (en) * 2005-11-15 2008-02-14 Mitsubishi Chemicals Corp Tetracarboxylic acid compound, polyimide thereof, and production method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101706402B1 (en) * 2012-04-03 2017-02-14 삼성에스디아이 주식회사 Water soluble binder composition, and Electrode for a rechargeable battery employing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825249B1 (en) 1994-12-26 2004-11-30 Hitachi Chemical Co., Ltd. Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
JP2008031406A (en) * 2005-11-15 2008-02-14 Mitsubishi Chemicals Corp Tetracarboxylic acid compound, polyimide thereof, and production method thereof

Also Published As

Publication number Publication date
JP2535545B2 (en) 1996-09-18

Similar Documents

Publication Publication Date Title
US4794157A (en) Polyetherimide copolymers, and method for making
US4886874A (en) Polyimide having excellent thermal dimensional stability
DE3587783D1 (en) Polyamic acids, polyimides, poly (esterimides).
JPS557805A (en) Preparation of polyimide molded articles
TW358829B (en) A method of forming a polyimide coating, a polyimidesiloxane coating/pattern on the surface of a substrate
EP0267289A4 (en) POLYIMIDE RESIN PREPARATION.
US5061784A (en) Polymers prepared from 4,4'-bis(3,4-dicarboxyphenyl) hexafluoroisopropyl) diphenyl dianhydride
JPS649226A (en) Polyimide and heat-resistant adhesive comprising same
JPS56118421A (en) Heat-shrinkable polyimide film and production thereof
US3455879A (en) Polyimides prepared from azo containing diamines
KR830006387A (en) Intermediate Products, Interpolymers and Methods of Making the Same
KR910009779A (en) Polyimide Manufacturing Method
JPS57143329A (en) Photosensitive resin and its production
US3413267A (en) Copolyimide-isoimide polymers
JPS55123620A (en) Production of polyoxyalkylene polyether having organosiloxane on molecular chain terminal
JPS6416833A (en) Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
JPS6416834A (en) Polyamic acid copolymer, polyimide copolymer therefrom and production thereof
KR870006158A (en) Adhesive Composition and Bonding Method Using Copper Adhesive
JPS649227A (en) Polyimide
CA2016188A1 (en) Polyimide polymers having 12-f fluorine-containing linking groups
JPS6416836A (en) Novel polyimide copolymer and polyamic acid copolymer and production thereof
JPS6420238A (en) Production of aromatic polyimide polymer molding
JPS6433133A (en) Reactive polyamic acid and its production
JPS61258836A (en) Production of polyamic acid solution
JPS6460655A (en) Polyimide composite material

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees