JPWO2012121237A1 - 蒸着装置及び薄膜形成方法 - Google Patents

蒸着装置及び薄膜形成方法 Download PDF

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Publication number: JPWO2012121237A1
Authority: JP; Japan
Prior art keywords: vapor deposition; film forming; forming material; belt; roller
Prior art date: 2011-03-09
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2013503551A

Other languages

English (en)

Japanese (ja)

Inventor

福田　和浩

和浩福田

硯里　善幸

善幸硯里

伸明高橋

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Konica Minolta Inc

Original Assignee

Konica Minolta Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-03-09

Filing date

2012-03-06

Publication date

2014-07-17

2012-03-06 Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc

2014-07-17 Publication of JPWO2012121237A1 publication Critical patent/JPWO2012121237A1/ja

Status Pending legal-status Critical Current

Links

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238000000034 method Methods 0.000 title claims description 24
239000010409 thin film Substances 0.000 title claims description 20
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238000001035 drying Methods 0.000 claims abstract description 37
238000003780 insertion Methods 0.000 claims abstract description 36
230000037431 insertion Effects 0.000 claims abstract description 36
230000008021 deposition Effects 0.000 claims abstract description 14
238000001704 evaporation Methods 0.000 claims abstract description 9
239000010408 film Substances 0.000 claims description 139
239000000758 substrate Substances 0.000 claims description 59
238000000151 deposition Methods 0.000 claims description 18
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238000007789 sealing Methods 0.000 description 6
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238000004804 winding Methods 0.000 description 5
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XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
239000002019 doping agent Substances 0.000 description 4
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239000002184 metal Substances 0.000 description 4
238000002360 preparation method Methods 0.000 description 4
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239000012298 atmosphere Substances 0.000 description 3
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VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
239000012300 argon atmosphere Substances 0.000 description 1
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239000003822 epoxy resin Substances 0.000 description 1
239000011888 foil Substances 0.000 description 1
239000011521 glass Substances 0.000 description 1
229920006015 heat resistant resin Polymers 0.000 description 1
239000003779 heat-resistant material Substances 0.000 description 1
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
229940011051 isopropyl acetate Drugs 0.000 description 1
GWYFCOCPABKNJV-UHFFFAOYSA-M isovalerate Chemical compound CC(C)CC([O-])=O GWYFCOCPABKNJV-UHFFFAOYSA-M 0.000 description 1
239000002346 layers by function Substances 0.000 description 1
238000004020 luminiscence type Methods 0.000 description 1
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239000012299 nitrogen atmosphere Substances 0.000 description 1
238000005268 plasma chemical vapour deposition Methods 0.000 description 1
229920000647 polyepoxide Polymers 0.000 description 1
-1 polyethylene terephthalate Polymers 0.000 description 1
229920000139 polyethylene terephthalate Polymers 0.000 description 1
239000005020 polyethylene terephthalate Substances 0.000 description 1
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238000009877 rendering Methods 0.000 description 1
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229910052814 silicon oxide Inorganic materials 0.000 description 1
238000009751 slip forming Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
229910052715 tantalum Inorganic materials 0.000 description 1
GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
230000003685 thermal hair damage Effects 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 1
WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
229910052721 tungsten Inorganic materials 0.000 description 1
239000010937 tungsten Substances 0.000 description 1
238000005019 vapor deposition process Methods 0.000 description 1
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
238000005303 weighing Methods 0.000 description 1

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroluminescent Light Sources (AREA)
Physical Vapour Deposition (AREA)

JP2013503551A 2011-03-09 2012-03-06 蒸着装置及び薄膜形成方法 Pending JPWO2012121237A1 (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2011051422		2011-03-09
JP2011051422		2011-03-09
PCT/JP2012/055640 WO2012121237A1 (fr)	2011-03-09	2012-03-06	Dispositif de dépôt en phase vapeur et procédé de formation de film fin

Publications (1)

Publication Number	Publication Date
JPWO2012121237A1 true JPWO2012121237A1 (ja)	2014-07-17

Family

ID=46798195

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2013503551A Pending JPWO2012121237A1 (ja)	2011-03-09	2012-03-06	蒸着装置及び薄膜形成方法

Country Status (2)

Country	Link
JP (1)	JPWO2012121237A1 (fr)
WO (1)	WO2012121237A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN115094383B (zh) *	2022-07-01	2023-06-30	江阴纳力新材料科技有限公司	一种基于蒸镀的复合正极集流体制备装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS59177365A (ja) *	1983-03-24	1984-10-08	Matsushita Electric Ind Co Ltd	蒸発方法とその装置
JP2615223B2 (ja) *	1989-12-19	1997-05-28	三菱重工業株式会社	連続真空蒸着装置
JPH10330918A (ja) *	1997-06-05	1998-12-15	Matsushita Electric Ind Co Ltd	蒸着方法および蒸着装置
JP3870516B2 (ja) *	1997-11-12	2007-01-17	凸版印刷株式会社	防汚性薄膜の形成方法
US6337102B1 (en) *	1997-11-17	2002-01-08	The Trustees Of Princeton University	Low pressure vapor phase deposition of organic thin films
JP3415801B2 (ja) *	2000-02-21	2003-06-09	三容真空工業株式会社	有機系被膜の蒸着方法とその装置
JP2009097063A (ja) *	2007-10-19	2009-05-07	Toppan Printing Co Ltd	真空成膜装置
JP5325016B2 (ja) *	2009-05-11	2013-10-23	日立造船株式会社	減圧ユニット及び圧力復元ユニット

2012
- 2012-03-06 JP JP2013503551A patent/JPWO2012121237A1/ja active Pending
- 2012-03-06 WO PCT/JP2012/055640 patent/WO2012121237A1/fr not_active Ceased

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Publication number	Publication date
WO2012121237A1 (fr)	2012-09-13

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