JPWO2021111966A1 - - Google Patents

Info

Publication number
JPWO2021111966A1
JPWO2021111966A1 JP2021562602A JP2021562602A JPWO2021111966A1 JP WO2021111966 A1 JPWO2021111966 A1 JP WO2021111966A1 JP 2021562602 A JP2021562602 A JP 2021562602A JP 2021562602 A JP2021562602 A JP 2021562602A JP WO2021111966 A1 JPWO2021111966 A1 JP WO2021111966A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2021562602A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021111966A1 publication Critical patent/JPWO2021111966A1/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Structure Of Printed Boards (AREA)
JP2021562602A 2019-12-05 2020-11-26 Withdrawn JPWO2021111966A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019220318 2019-12-05
PCT/JP2020/043952 WO2021111966A1 (fr) 2019-12-05 2020-11-26 Carte de câblage ayant une pièce métallique

Publications (1)

Publication Number Publication Date
JPWO2021111966A1 true JPWO2021111966A1 (fr) 2021-06-10

Family

ID=76222373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562602A Withdrawn JPWO2021111966A1 (fr) 2019-12-05 2020-11-26

Country Status (2)

Country Link
JP (1) JPWO2021111966A1 (fr)
WO (1) WO2021111966A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022204292A1 (de) * 2022-05-02 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktanordnung mit einer verschweißten flexiblen Leiterplatte

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0765717A (ja) * 1993-08-20 1995-03-10 Sony Corp レーザー溶接方法
JP3750313B2 (ja) * 1997-10-03 2006-03-01 株式会社デンソー 溶接構造
JP5118862B2 (ja) * 2007-03-05 2013-01-16 トヨタ自動車株式会社 レーザ接合方法
EP3733339B1 (fr) * 2017-12-28 2024-02-07 Fujikura Ltd. Structure de soudage, carte câblée avec pièce métallique

Also Published As

Publication number Publication date
WO2021111966A1 (fr) 2021-06-10

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211208

A761 Written withdrawal of application

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Effective date: 20220603