KR200328632Y1 - 캐리어테이프 이송부재 - Google Patents
캐리어테이프 이송부재 Download PDFInfo
- Publication number
- KR200328632Y1 KR200328632Y1 KR20-2003-0022691U KR20030022691U KR200328632Y1 KR 200328632 Y1 KR200328632 Y1 KR 200328632Y1 KR 20030022691 U KR20030022691 U KR 20030022691U KR 200328632 Y1 KR200328632 Y1 KR 200328632Y1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier tape
- present
- electronic components
- bent
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
- H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1904—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing chips, dies or ICs
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (3)
- 전자부품 수납용 엠보스 부(embossed portion) 및 피치홀(pitch hole)이 소정의 간격으로 배열된 캐리어테이프의 이송을 가이드하기 위해 띠 형태의 직사각판 형상으로 양측단부가 'ㄷ' 자 형상으로 절곡되어 캐리어테이프의 상단에 길이방향으로 결합되는 것을 특징으로 하는 캐리어테이프 이송부재.
- 제 1 항에 있어서,상기 'ㄷ'자 형상으로 절곡된 양측 단부는 캐리어테이프의 엠보스 부 및 피치 홀에 간섭을 주지 않도록 소정의 길이만큼 절곡된 것을 특징으로 하는 캐리어테이프 이송부재.
- 제 1 항 또는 제 2 항에 있어서,상기 캐리어테이프 이송부재는 투명 또는 불투명한 합성수지 재질로 이루어지되, 표면저항률이 1×1011Ω 이하인 것을 특징으로 하는 캐리어테이프 이송부재.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0022691U KR200328632Y1 (ko) | 2003-07-14 | 2003-07-14 | 캐리어테이프 이송부재 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2003-0022691U KR200328632Y1 (ko) | 2003-07-14 | 2003-07-14 | 캐리어테이프 이송부재 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030047824A Division KR20050008941A (ko) | 2003-07-14 | 2003-07-14 | 캐리어테이프 이송부재 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200328632Y1 true KR200328632Y1 (ko) | 2003-09-29 |
Family
ID=49416356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-2003-0022691U Expired - Fee Related KR200328632Y1 (ko) | 2003-07-14 | 2003-07-14 | 캐리어테이프 이송부재 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200328632Y1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230106813A (ko) | 2022-01-07 | 2023-07-14 | 이승희 | 표면 실장 부품 공급 장치 및 방법, 이에 사용되는 표면 실장 부품 스트립 |
-
2003
- 2003-07-14 KR KR20-2003-0022691U patent/KR200328632Y1/ko not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230106813A (ko) | 2022-01-07 | 2023-07-14 | 이승희 | 표면 실장 부품 공급 장치 및 방법, 이에 사용되는 표면 실장 부품 스트립 |
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St.27 status event code: A-5-5-P10-P19-oth-UG1701 Gazette reference publication date: 20030929 Gazette number: 2003286320000 Patent document republication publication date: 20050811 Republication note text: Request for Correction Notice Based on Technical Evaluation |
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