KR20140123480A - 전자 디바이스 구조체를 제공하는 방법 및 관련된 전자 디바이스 구조체들 - Google Patents

전자 디바이스 구조체를 제공하는 방법 및 관련된 전자 디바이스 구조체들 Download PDF

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Publication number
KR20140123480A
KR20140123480A KR1020147017870A KR20147017870A KR20140123480A KR 20140123480 A KR20140123480 A KR 20140123480A KR 1020147017870 A KR1020147017870 A KR 1020147017870A KR 20147017870 A KR20147017870 A KR 20147017870A KR 20140123480 A KR20140123480 A KR 20140123480A
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KR
South Korea
Prior art keywords
substrate
adhesive
substrate surface
carrier substrate
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147017870A
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English (en)
Korean (ko)
Inventor
에메트 하워드
더글라스 이 로이
니콜라스 무니자
Original Assignee
아리조나 보드 오브 리전트스, 아리조나주의 아리조나 주립대 대행법인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아리조나 보드 오브 리전트스, 아리조나주의 아리조나 주립대 대행법인 filed Critical 아리조나 보드 오브 리전트스, 아리조나주의 아리조나 주립대 대행법인
Publication of KR20140123480A publication Critical patent/KR20140123480A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020147017870A 2011-11-29 2012-11-28 전자 디바이스 구조체를 제공하는 방법 및 관련된 전자 디바이스 구조체들 Withdrawn KR20140123480A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161564535P 2011-11-29 2011-11-29
US61/564,535 2011-11-29
PCT/US2012/066833 WO2013082138A1 (fr) 2011-11-29 2012-11-28 Procédé permettant d'obtenir une structure de dispositif électronique et structures de dispositif électronique correspondantes

Publications (1)

Publication Number Publication Date
KR20140123480A true KR20140123480A (ko) 2014-10-22

Family

ID=48536005

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147017870A Withdrawn KR20140123480A (ko) 2011-11-29 2012-11-28 전자 디바이스 구조체를 제공하는 방법 및 관련된 전자 디바이스 구조체들

Country Status (7)

Country Link
EP (1) EP2786645A4 (fr)
JP (1) JP2014533893A (fr)
KR (1) KR20140123480A (fr)
CN (1) CN104041199A (fr)
SG (1) SG11201402622YA (fr)
TW (1) TW201345726A (fr)
WO (1) WO2013082138A1 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9991311B2 (en) 2008-12-02 2018-06-05 Arizona Board Of Regents On Behalf Of Arizona State University Dual active layer semiconductor device and method of manufacturing the same
JP5832780B2 (ja) 2011-05-24 2015-12-16 株式会社半導体エネルギー研究所 半導体装置の製造方法
WO2015156891A2 (fr) 2014-01-23 2015-10-15 Arizona Board Of Regents, Acting For And On Behalf Of Arizona State University Procédé de fabrication d'un dispositif à semi-conducteur souple et dispositif à semi-conducteur souple associé
WO2017034644A2 (fr) 2015-06-09 2017-03-02 ARIZONA BOARD OF REGENTS a body corporate for THE STATE OF ARIZONA for and on behalf of ARIZONA STATE UNIVERSITY Procédé permettant d'obtenir un dispositif électronique et dispositif électronique correspondant
US10381224B2 (en) 2014-01-23 2019-08-13 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an electronic device and electronic device thereof
SG11201606059WA (en) * 2014-01-27 2016-08-30 Corning Inc Articles and methods for controlled bonding of polymer surfaces with carriers
KR102466741B1 (ko) 2014-05-13 2022-11-15 아리조나 보드 오브 리젠츠 온 비하프 오브 아리조나 스테이트 유니버시티 전자 디바이스를 제공하는 방법
US10446582B2 (en) 2014-12-22 2019-10-15 Arizona Board Of Regents On Behalf Of Arizona State University Method of providing an imaging system and imaging system thereof
US9741742B2 (en) 2014-12-22 2017-08-22 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona, Acting For And On Behalf Of Arizona State University Deformable electronic device and methods of providing and using deformable electronic device
CN106527796B (zh) * 2016-10-31 2019-06-07 京东方科技集团股份有限公司 一种面板制作方法、触控面板及显示设备
CN110065267B (zh) 2019-04-26 2021-03-26 京东方科技集团股份有限公司 可形变材料、形变结构、Micro-LED显示装置、应变传感器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4087300A (en) * 1974-01-07 1978-05-02 Edward Adler Process for producing metal-plastic laminate
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
US5837380A (en) * 1995-12-26 1998-11-17 Lucent Technologies, Inc. Multilayer structures and process for fabricating the same
US7223672B2 (en) * 2002-04-24 2007-05-29 E Ink Corporation Processes for forming backplanes for electro-optic displays
JP2004311912A (ja) * 2002-12-06 2004-11-04 Sony Corp 回路基板モジュール及びその製造方法
US20090200543A1 (en) * 2008-02-08 2009-08-13 Roger Stanley Kerr Method of forming an electronic device on a substrate supported by a carrier and resultant device
JP4888736B2 (ja) * 2008-08-29 2012-02-29 Ｔｄｋ株式会社 配線基板の製造方法
EP2366270A4 (fr) * 2008-12-02 2013-04-10 Univ Arizona Procédé de préparation d'un substrat souple et substrat souple ainsi obtenu
US9409383B2 (en) * 2008-12-22 2016-08-09 Apple Inc. Layer-specific energy distribution delamination

Also Published As

Publication number Publication date
WO2013082138A1 (fr) 2013-06-06
EP2786645A4 (fr) 2016-11-09
CN104041199A (zh) 2014-09-10
JP2014533893A (ja) 2014-12-15
SG11201402622YA (en) 2014-06-27
EP2786645A1 (fr) 2014-10-08
TW201345726A (zh) 2013-11-16

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140627

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid