KR910020060A - 잠재성 촉매, 경화-억제된 에폭시수지 조성물 및 이로부터 제조한 적층물 - Google Patents

잠재성 촉매, 경화-억제된 에폭시수지 조성물 및 이로부터 제조한 적층물 Download PDF

Info

Publication number
KR910020060A
KR910020060A KR1019910008147A KR910008147A KR910020060A KR 910020060 A KR910020060 A KR 910020060A KR 1019910008147 A KR1019910008147 A KR 1019910008147A KR 910008147 A KR910008147 A KR 910008147A KR 910020060 A KR910020060 A KR 910020060A
Authority
KR
South Korea
Prior art keywords
acetate
catalyst
methyl
resin
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019910008147A
Other languages
English (en)
Other versions
KR100229301B1 (ko
Inventor
엘. 버트람 제임스
제트. 호츠 챨리
엘. 워커 루이스
강 죠셉
Original Assignee
리챠드. 지. 워터맨
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/526,488 external-priority patent/US5169473A/en
Application filed by 리챠드. 지. 워터맨, 더 다우 케미칼 캄파니 filed Critical 리챠드. 지. 워터맨
Publication of KR910020060A publication Critical patent/KR910020060A/ko
Application granted granted Critical
Publication of KR100229301B1 publication Critical patent/KR100229301B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/203—Electrical connections
    • H10W44/206—Wires

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
  • Wrappers (AREA)
  • Retarders (AREA)

Abstract

내용 없음

Description

잠재성 촉매, 경화-억제된 에폭시수지 조성물 및 이로부터 제조한 적층물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (20)

  1. A. 폴리에폭사이드; 및 B. 붕상 또는 말레산, 또는 붕산과 약친핵성 음이온을 갖는 산 하나 이상과의 혼합물을 포함하는 경화 억제제를 포함하는 에폭시 수지 조성물.
  2. A. 승온에서 폴리에폭사이드와 반응할 수 있는 경화제; 및 B. 붕산또는 말레선, 또는 붕산과 약친핵성 음이온을 갖는 산 하나 이상과의 혼합물의 억제량을 포함하는, 폴리에폭사이드 또는 진척된(advanced)에폭시 수지를 경화시키는데 유용한 조성물.
  3. 제1항에 있어서, 승온에서 폴리에폭사이드와 반응할 수 있는 경화제를 추가로 포함하는 에폭시 수지 조성물.
  4. 제1항 내지 제3항중 어느 한항에 있어서, 아민, 헤테르사이클릭 질소, 포스핀, 황화물, 암모늄, 포스포늄, 아르소늄, 또는 설포늄-함유 화합물 또는 이러한 화합물들의 혼합물을 포함하는, 경화제에 의한 폴리에폭사이드의 경화를 가속화시킬 수 있는 에폭시 수지 촉매를 추가로 포함하는 조성물.
  5. i)아민, 헤테로사이클릭 질소, 포스핀, 황화물, 암모늄, 포스포늄, 설포늄 또는 아르소늄-함유 화합물 또는 이의 혼합물을 포함하는 폴리에폭사이드 경화용 촉매를, ii)붕산, 또는 붕산과 약친핵성 음이온을 갖는 산하나 이상과의 혼합물과 접촉시켜 제조한 폴리에폭사이드 경화용 잠재성 촉매.
  6. 제4항에 있어서, 경화 억제제및 촉매가 제5항에 따른 잠재성 촉매 조성물의 형태로 존재함을 특징으로 하는 조성물.
  7. 제4항 내지 제6항중 어느 한 항에 있어서, 촉매가 에틸틀리페닐 포스포늄 아세테이트, 에틸트리페닐 포스포늄 아세테이트, 아세트산 착화합물, 테트라부틸 포스포늄 아세테이트, 테트라부틸 포스포튬 아세테이트, 아세트산 착화합물, 에틸트리페닐 포스포늄 클로라이드, 에틸 트리페닐 포스포늄 요오다이드, 테트라부틸 포스포늄 클로라이드, 테트라부틸 포스포늄 요오다이드 및 테트라부틸포스포늄 하이드록사이드로 이루어진 그룹중에서 선택된 포스포늄 화합물; 테트라부틸암모늄 하이드록사이드, 테트라에틸암모늄 하이드록사이드, 테트라메틸암모늄 하이드록사이드, 에틸트리(2-에톡시에틸)암모늄 하이드록사이드, 트리에틸(2-티오에틸에틸)암모늄 하이드록사이드, N-메틸-N-메틸메탄암미늄 아세테이트, N-메틸-N메틸렌메탄암미늄 아세테이트, 아세트산 착화합물, N-메틸렌메탄암미늄 클로라이드, N-메틸-메틸메탄암미늄 요오다이드, N-메틸피라디늄 아세테이트, N-메틸피리디늄 아세테이트, 아세트산 착화합물, N-메틸-N-메틸피라디늄 클로라이드, N-메틸피리디늄 요오다이드, 1-에틸-2,3-디메틸이미다졸롬 아세테이트, 1-에틸-2,3-디메틸-이미다졸륨 아세테이트, 아세트산 착화합물, 1-에틸-2,3-디메틸이미다졸륨 클로라이드, 1-에틸-2-3디메틸-이미다졸륨 요오다이드, N-메틸퀴놀리늄 아세테이트, N-메틸퀴놀리늄 아세테이트, 아세트산 착화합물, N-메틸퀴놀리늄 클로라이드, N-메틸퀴놀리늄 요오다이드, N-메틸-1,3,5-트리아지늄 아세테이트, N-메틸-1,3,5-트리아지늄 아세테이트, 아세트산 착화합물, N-메틸-1,3,5-트리아지늄 클로라이드 및 N-메틸-1,3,5-트리아지늄 요오다이드로 이루어진 그룹중에서 선택된 암모늄 화합물; 에틸아민, 디에틸아민, 트리에틸아민, n-프로필아민, 디-n-프로필아민, 트리-n-프로필아민, 이소프로필아민, 디이소프로필아민, 트리이소프로필아민, 부틸아민, 디부틸아민, 트리부틸아민 및 메틸디부틸아민으로 이루어진 그룹중에서 선택된 비-헤케로사이클릭 아민; 이미다졸, 이미다졸리딘, 이미다졸린, 옥사졸, 피톨, 티아졸, 피리딘, 피라진, 모르폴린, 피리다진, 피리미딘, 피틀리딘, 피라졸, 퀴녹살린, 퀴나졸린, 프탈로진, 퀴놀린, 퓨린, 인다졸, 인돌, 인돌아진, 페나진, 페나르사진, 페노티아진, 피롤린, 인돌린, 피페리딘 및 피페라진으로 이루어진 그룹중에서 선택된 헤테로사이클릭 아민; 또는 이들의 특정 혼합물이며, 약친핵성 음이온을 갖는 산이 존재하는 경우에는 이 산이 플루오로붕산인 조성물.
  8. 제4항 내지 제7항중 어느 한항에 있어서, 촉매가 3급 아민-함유 화합물 또는 헤테로사이클릭 아민-함유화합물인 조성물.
  9. 제4항 내지 제7항중 어느 한항에 있어서, 촉매가 2-메틸 이미다졸, 2-에틸 이미다졸, 4-메틸 이미다졸 또는 2-페닐 이미다졸인 조성물.
  10. 제2항 내지 제4항 및 제6항 내지 제9항중 어느 한항에 있어서, 경화제가 무수물, 방향족 하이드록실 하나이상을 함유하는 화합물, 폴리아미드 또는 폴리아민인 조성물.
  11. 제2항 내지 제4항 및 제6항 내지 제9항중 어느 한항에 있어서, 경화제가 시안아미드, 디시안아미드, 시안아미드 또는 디시안아미드의 유도체, 디하이드록시 페놀, 비페놀, 비스페놀, 할로겐화 비스페놀, 알킬화 비스페놀, 트리스페놀, 페놀-알데히드 수지 할로겐화 페놀-알데히드 노볼락 수지, 알킬화 페놀-알데히드 노볼로 수지, 페놀-하이드록시벤즈 알데히드 수지, 알킬화 페놀-하이드록시벤즈알데히드 수지, 탄화수소-페놀수지, 탄화수소-할로겐화 페놀 수지, 탄화수소-알킬 페놀 수지, 또는 이의 혼합물인 조성물.
  12. A)임의로는 하나 이상의 혼화성 용매중에 존재하는 제3항 내지 제10항중 어느 한항에 따른 조성물을 제품과 접촉시키고, B)임의로는, 상기 피복제품을, 존재하는 특정용매를 증발시키기에는 충분하나, 폴리에폭사이드가 현저히, 경화되지 않는 온도이하에서 가열 영역으로 통과시키고; C)임의로는 피복 제품을 폴리에폭사이드가 적어도 부분적으로 경화될 수 있도록 하는 조건하에 노출시킴을 특징으로 하여 제품을 피복시키는 방법.
  13. 제12항에 있어서, 촉매 및 억제제가 예비생성된 착화합물의 형태로 존재하는 방법.
  14. 제11항 내지 제13항중 어느 한항에 있어서, 에폭시 수지 조성물이, i)비극성 용매중 폴리에폭사이드100부, ii)용매 중수지 100당 경화제0.5내지 30부, iii)극성 용매 중 수지 100부당 붕산 0.01내지 2.0부, 및 iV)수지 100부당 촉매 0.01내지 2.0부를 포함하며, 촉매에 대한 억제제의 비가 0.1:1 내지 4.0:1.0 인 방법.
  15. 제14항에 있어서, C. 피복된 보강물질의 세그먼트(segmant)를 형성시키고, D. 피복된 보강물질의 세그먼트를 목적하는 배열로 접촉시키며, E. 피복된 보강물질의 접촉된 세그먼트를 폴리에폭사이드가 현저히 경화되는 온도에서 가압(이때 압력은 각각의 세그먼트상 폴레에폭사이드가 유동하여, 인접한 세그먼트상 폴리에폭사이드 또는 진척된 에폭시 수지와 혼합되도록 하기에 충분하다)시킴을 추가로 포함하여, 제품이 보강물질인 적층물의 제조하는 방법.
  16. 제3항 내지 제10항중 어느 한항에 따른 조성물의 부분 경화 반응 생성물(이때, 이 생성물을 추가로 경화될 수 있다)을 포함하는 조성물.
  17. 겔화 시간을 증가시키기 위해 붕산의 농도를 증가시키거나 또는 겔화 시간을 감소시키기 위해 붕산의 농도를 감소시킴으로써 억제제의 농도를 조절함을 특징으로 하여, 제3항, 제4항 및 제6항 내지 제10항중 어느 한항에 따른 조성물의 겔화 시간을 조정하는 방법.
  18. 제1항 내지 제10항에 있어서, 디-또는 트리하이드록시 치환된 탄화수소 용매의 용액중에서 붕산을 본 발명의 다른 성분하나 이상과 접촉시킴을 특징으로 하는 조성물.
  19. 제18항에 있어서, 용매가 1,2-프로판디올, 에틸렌글리콜 또는 글리세린인 조성물.
  20. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910008147A 1990-05-21 1991-05-20 에폭시 수지 조성물 및 폴리에폭사이드 경화용 잠재성 촉매 Expired - Lifetime KR100229301B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US52648790A 1990-05-21 1990-05-21
US526488 1990-05-21
US07/526,488 US5169473A (en) 1990-05-21 1990-05-21 Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions
US07/526,487 1990-05-21
US7/526,487 1990-05-21

Publications (2)

Publication Number Publication Date
KR910020060A true KR910020060A (ko) 1991-12-19
KR100229301B1 KR100229301B1 (ko) 1999-11-01

Family

ID=27062123

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910008147A Expired - Lifetime KR100229301B1 (ko) 1990-05-21 1991-05-20 에폭시 수지 조성물 및 폴리에폭사이드 경화용 잠재성 촉매

Country Status (15)

Country Link
EP (1) EP0458502B1 (ko)
JP (5) JP3080245B2 (ko)
KR (1) KR100229301B1 (ko)
CN (3) CN1035823C (ko)
AT (1) ATE243227T1 (ko)
AU (1) AU657264B2 (ko)
BR (1) BR9102108A (ko)
CA (1) CA2042858A1 (ko)
DE (1) DE69133280T2 (ko)
FI (1) FI912435A7 (ko)
IL (1) IL98185A (ko)
MY (1) MY141502A (ko)
NO (1) NO911933L (ko)
PT (1) PT97724A (ko)
SG (1) SG43193A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079381A (ko) * 2018-12-24 2020-07-03 주식회사 하이플럭스 내화 조성물

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4981926A (en) * 1990-02-06 1991-01-01 The Dow Chemical Company Composition of epoxy resin, amino group-containing phosphonium catalyst and curing agent
GB9103402D0 (en) * 1991-02-19 1991-04-03 Pilkington Plc Fire resistance
GB9208955D0 (en) * 1992-04-24 1992-06-10 Dow Europ Sa Dicyandiamide solution
US5407977A (en) * 1993-04-20 1995-04-18 The Dow Chemical Company Solvent system
US5464910A (en) * 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
GB9421407D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Curable epoxy resin accelerated by boric acid and its analogs
GB9421405D0 (en) * 1994-10-21 1994-12-07 Dow Chemical Co Low voc laminating formulations
US5508328A (en) * 1994-11-17 1996-04-16 Alliedsignal Inc. Curing epoxy resins using dicy, imidazole and acid
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
WO1998031750A1 (en) † 1997-01-21 1998-07-23 The Dow Chemical Company Latent catalysts for epoxy curing systems
US6353080B1 (en) 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
WO2001042253A2 (en) 1999-12-13 2001-06-14 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
CN1423678B (zh) 1999-12-13 2010-11-10 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
KR100419063B1 (ko) * 2000-06-10 2004-02-14 주식회사 엘지화학 에폭시 수지 조성물 및 이를 이용한 적층판
JP4534344B2 (ja) * 2000-11-27 2010-09-01 住友ベークライト株式会社 難燃性樹脂組成物、これを用いたプリプレグ及び積層板
KR100854544B1 (ko) * 2001-09-12 2008-08-26 다우 글로벌 테크놀로지스 인크. 에폭시-말단의 에스테르를 포함하는 망상구조 중합체
EP1391490A1 (en) * 2002-08-23 2004-02-25 Vantico Gmbh Modified epoxy resins for triboelectric coating processes
ATE346877T1 (de) * 2003-04-16 2006-12-15 Huntsman Adv Mat Switzerland Härtungsbeschleuniger für epoxyharzzusammensetzungen härtend bei niedriger temperatur
JP4895487B2 (ja) * 2003-08-05 2012-03-14 一般財団法人川村理化学研究所 熱硬化性樹脂組成物及びその製造方法、成型物の製造方法
US20060247334A1 (en) * 2003-08-05 2006-11-02 Akira Ohbayashi Epoxy resin composition and method for producing heat-resistant laminate sheet
JP4558359B2 (ja) * 2004-03-22 2010-10-06 財団法人川村理化学研究所 エポキシ樹脂組成物及びそれを用いた銅張積層板
EP1753772B1 (en) 2004-05-28 2016-12-28 Blue Cube IP LLC Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers
WO2006109744A1 (ja) 2005-04-07 2006-10-19 Asahi Kasei Chemicals Corporation エポキシ樹脂組成物
DE102005029146A1 (de) * 2005-06-23 2006-12-28 Cognis Ip Management Gmbh Härter für Überzugmassen (IV)
EP1754733A1 (en) * 2005-07-26 2007-02-21 Huntsman Advanced Materials (Switzerland) GmbH Composition
US7998653B2 (en) 2005-09-15 2011-08-16 Ciba Corp. Coating compositions comprising a latent activator for marking substrates
WO2007037024A1 (ja) * 2005-09-27 2007-04-05 Sumitomo Bakelite Co., Ltd. 潜伏性触媒の製造方法及びエポキシ樹脂組成物
KR20080077639A (ko) * 2005-12-22 2008-08-25 다우 글로벌 테크놀로지스 인크. 경화성 에폭시 수지 조성물 및 이로부터 제조한 적층물
JP5114111B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
JP5114112B2 (ja) * 2006-09-07 2013-01-09 日東シンコー株式会社 樹脂組成物、熱伝導シート、金属箔付高熱伝導接着シート、ならびに、金属板付高熱伝導接着シート
MY146613A (en) 2007-06-11 2012-09-14 Basf Se Catalyst for curing epoxides
CN101679607B (zh) 2007-06-12 2012-05-30 巴斯夫欧洲公司 用于固化环氧化物的催化剂
ES2354399T3 (es) 2007-06-13 2011-03-14 Basf Se Catalizador para el endurecimento de epóxidos.
CN101687977B (zh) * 2007-06-14 2012-08-15 巴斯夫欧洲公司 用于固化环氧化物的催化剂
JP5581208B2 (ja) 2007-07-18 2014-08-27 データレース リミテッド レーザー感受性被覆配合物
EP2174969A4 (en) * 2007-07-26 2012-07-25 Ajinomoto Kk RESIN COMPOSITION
US20110136993A1 (en) 2008-08-28 2011-06-09 Dow Global Technologies Llc Phosphorus-containing compounds and polymeric compositions comprising same
KR101782567B1 (ko) 2008-10-23 2017-09-27 데이터레이즈 리미티드 열 흡수 첨가제
US9267042B2 (en) 2008-10-27 2016-02-23 Datalase Ltd. Coating composition for marking substrates
KR20110139271A (ko) * 2009-03-17 2011-12-28 다우 글로벌 테크놀로지스 엘엘씨 사이클릭 디아민을 함유하는 경화성 조성물 및 이로부터의 경화물
DE102009027826A1 (de) 2009-04-29 2010-11-04 Evonik Degussa Gmbh Katalyse von Epoxidharzformulierungen
KR100925986B1 (ko) 2009-06-20 2009-11-10 정송옥 상·하수도 노후관 갱생용의 잠재성 중온 속경화형 에폭시 수지 조성물의 제조방법.
US8871892B2 (en) * 2009-11-12 2014-10-28 Dow Global Technologies Llc Polyoxazolidone resins
CN101728038A (zh) * 2009-12-04 2010-06-09 上海长园维安电子线路保护股份有限公司 热固性正温度系数热敏电阻器的制造方法及所用导电胶
EP2452978A1 (de) 2010-11-16 2012-05-16 Basf Se Verfahren zur Herstellung von mit Kohlenstoff-Füllstoffen gefüllten Epoxidharzformmassen
US9499653B2 (en) * 2011-02-23 2016-11-22 Alzchem Ag Curing agents for epoxy resins
WO2012136273A1 (de) 2011-04-08 2012-10-11 Basf Se Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen
CN102443168B (zh) * 2011-10-10 2016-03-09 苏州科技学院 一种多孔固体胺及其制备方法
WO2013188071A1 (en) * 2012-06-15 2013-12-19 Dow Global Technologies Llc Latent catalyst for curable compositions
DK2695903T3 (en) * 2012-08-08 2019-01-14 Siemens Ag Process for modifying the rate of temperature change of an epoxy resin composition in a resin container in a casting process
RU2015120176A (ru) * 2012-12-11 2017-01-19 Клариент Дайагностик Сервисез, Инк. Фотоактивированное химическое обесцвечивание красителей
JP5758463B2 (ja) * 2013-03-26 2015-08-05 太陽インキ製造株式会社 エポキシ樹脂組成物、穴埋め充填用組成物およびこれらを用いたプリント配線板
KR101885703B1 (ko) * 2013-05-14 2018-08-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 피라진-함유 화합물을 포함하는 에폭시 수지
DE102013008723A1 (de) 2013-05-23 2014-11-27 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung
US10253136B2 (en) 2014-02-06 2019-04-09 Adeka Corporation Compound and epoxy resin composition containing same
JP6240940B2 (ja) * 2014-02-06 2017-12-06 株式会社Adeka エポキシ樹脂組成物
EP3137560B1 (en) * 2014-04-29 2020-06-03 Akzo Nobel Coatings International B.V. Coating method for surfaces in chemical installations
US10556985B2 (en) * 2015-11-17 2020-02-11 Evonik Operations Gmbh Nitrogen-containing heterocyclic epoxy curing agents, compositions and methods
US10465039B2 (en) 2015-11-17 2019-11-05 Evonik Degussa Gmbh Epoxy curing agents, compositions and uses thereof
CN107446535A (zh) * 2017-08-16 2017-12-08 浙江林境新材料科技有限公司 一种复合板
CN108565041B (zh) * 2018-04-20 2020-04-28 四川省银河化学股份有限公司 一种高电导耐焊接型低温银浆及其制备方法
EP3569629B1 (de) * 2018-05-17 2022-07-06 Evonik Operations GmbH Schnell härtende epoxysysteme
WO2020050200A1 (ja) 2018-09-05 2020-03-12 三菱ケミカル株式会社 シートモールディングコンパウンド、および繊維強化複合材料
JP7261563B2 (ja) * 2018-11-02 2023-04-20 谷川油化興業株式会社 熱交換媒体
DE102019121195A1 (de) * 2019-08-06 2021-02-11 Alzchem Trostberg Gmbh Lagerstabile Epoxidharz-Zusammensetzung
CN111892695B (zh) * 2020-07-13 2022-12-30 四川省玻纤集团有限公司 耐γ辐照的改性树脂及其制备方法、层压板及其制备工艺与应用
KR102906330B1 (ko) * 2023-01-12 2025-12-30 도레이첨단소재 주식회사 인장신율이 향상된 에폭시 수지 조성물과 이로부터 제조되는 강화섬유 복합재료
CN117124521B (zh) * 2023-07-25 2026-02-03 中国工程物理研究院化工材料研究所 一种通过取向填料含量V字形调控热压成型环氧vitrimer复合材料动态性能的方法
CN118421192B (zh) * 2024-07-04 2024-08-30 湖南飘峰电气股份有限公司 防火耐高温聚酰亚胺电磁线及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001156A (en) * 1972-08-03 1977-01-04 Ppg Industries, Inc. Method of producing epoxy group-containing, quaternary ammonium salt-containing resins
US4594291A (en) * 1984-07-17 1986-06-10 The Dow Chemical Company Curable, partially advanced epoxy resins
IL75806A (en) * 1984-07-17 1988-10-31 Dow Chemical Co Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
US4668758A (en) * 1985-09-30 1987-05-26 Shell Oil Company Cure rate control in epoxy resin compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200079381A (ko) * 2018-12-24 2020-07-03 주식회사 하이플럭스 내화 조성물

Also Published As

Publication number Publication date
SG43193A1 (en) 1997-10-17
JP2000309626A (ja) 2000-11-07
EP0458502A2 (en) 1991-11-27
CN1050617C (zh) 2000-03-22
KR100229301B1 (ko) 1999-11-01
AU657264B2 (en) 1995-03-09
CN1118794A (zh) 1996-03-20
IL98185A (en) 1994-06-24
JP2000136288A (ja) 2000-05-16
CN1050618C (zh) 2000-03-22
JP3269621B2 (ja) 2002-03-25
IL98185A0 (en) 1992-06-21
ATE243227T1 (de) 2003-07-15
JP3080245B2 (ja) 2000-08-21
EP0458502B1 (en) 2003-06-18
CN1118793A (zh) 1996-03-20
NO911933D0 (no) 1991-05-16
CN1035823C (zh) 1997-09-10
PT97724A (pt) 1992-03-31
DE69133280D1 (de) 2003-07-24
JP2002178342A (ja) 2002-06-26
BR9102108A (pt) 1991-12-24
DE69133280T2 (de) 2004-05-06
JPH11310627A (ja) 1999-11-09
AU7721191A (en) 1991-11-21
JP3321429B2 (ja) 2002-09-03
EP0458502A3 (en) 1992-12-02
CN1056699A (zh) 1991-12-04
FI912435A7 (fi) 1991-11-22
JP3383658B2 (ja) 2003-03-04
CA2042858A1 (en) 1991-11-22
JP3333762B2 (ja) 2002-10-15
NO911933L (no) 1991-11-22
JPH04227924A (ja) 1992-08-18
FI912435A0 (fi) 1991-05-20
MY141502A (en) 2010-05-14

Similar Documents

Publication Publication Date Title
KR910020060A (ko) 잠재성 촉매, 경화-억제된 에폭시수지 조성물 및 이로부터 제조한 적층물
US4171420A (en) Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
US4132706A (en) Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids
TWI485177B (zh) 環氧樹脂之硬化劑組成物及含有此類硬化劑組成物之環氧樹脂組成物
JP4080546B2 (ja) エポキシ硬化系のための潜触媒
EP2507325B1 (en) Coating compositions
US3438937A (en) Process for curing polyepoxides and resulting products
US3507831A (en) Process for curing epoxy resins with polycarboxylic anhydrides in presence of n-alkyl imidazoles
US5169473A (en) Latent catalysts, epoxy compositions incorporating same, and coating, impregnating and bonding methods employing the compositions
JPH07252345A (ja) 弾性エポキシ樹脂−硬化剤系
US3635869A (en) Catalysis of epoxy resin/carboxylic acid systems with trivalent chromium iii tricarboxylate salts
US4611036A (en) Epoxy resin composition
TWI555771B (zh) 潛在性硬化劑組成物及一液硬化性環氧樹脂組成物
US3355315A (en) Process for treating oily surfaces with polyepoxide compositions
KR920008159A (ko) 액체 피복제
US4634757A (en) Fusion product
US3305501A (en) Water solubilized epoxy resin esters of fumaric- or itaconic-fatty acid adducts
EP0786481B1 (en) Reactive accelerators for amine cured epoxy resins
CN1281476A (zh) 用作不受水影响的环氧树脂硬化剂的促进剂的酚醛树脂
EP0328020B1 (en) Use of a catalyst in epoxy compositions
US5102702A (en) Binder mixtures crosslinkable by radiation
JPH09235354A (ja) アミン変性エポキシ樹脂の製造方法
JPS6178826A (ja) 溶剤系用ノボラツク型エポキシ樹脂硬化剤
US4529537A (en) Liquid epoxy resin hardeners and processes for their preparation
EP0033169A1 (en) Thermosetting binders, preparation and use in lacquers

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19910520

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19960520

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19910520

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19980929

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19990531

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19990816

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19990817

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

Patent event code: PG17011E01I

Patent event date: 19991202

Comment text: Request for Publication of Correction

Publication date: 20000315

PR1001 Payment of annual fee

Payment date: 20020615

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20030619

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20040610

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20050603

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20060810

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20070808

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20080808

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20090807

Start annual number: 11

End annual number: 11

FPAY Annual fee payment

Payment date: 20100811

Year of fee payment: 12

PR1001 Payment of annual fee

Payment date: 20100811

Start annual number: 12

End annual number: 12

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20121009

Termination category: Expiration of duration