KR940010293A - 파워모듈 - Google Patents

파워모듈 Download PDF

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Publication number
KR940010293A
KR940010293A KR1019930021249A KR930021249A KR940010293A KR 940010293 A KR940010293 A KR 940010293A KR 1019930021249 A KR1019930021249 A KR 1019930021249A KR 930021249 A KR930021249 A KR 930021249A KR 940010293 A KR940010293 A KR 940010293A
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KR
South Korea
Prior art keywords
power module
device chip
heat spreader
power
power device
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Application number
KR1019930021249A
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English (en)
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KR100307465B1 (ko
Inventor
오사무 우메다
Original Assignee
야스후꾸 마다미
가부시기가이샤 후지쯔 제네랄
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Priority claimed from JP1992073067U external-priority patent/JP2555796Y2/ja
Priority claimed from JP073068U external-priority patent/JPH0638248U/ja
Priority claimed from JP7306992U external-priority patent/JPH0638246U/ja
Application filed by 야스후꾸 마다미, 가부시기가이샤 후지쯔 제네랄 filed Critical 야스후꾸 마다미
Publication of KR940010293A publication Critical patent/KR940010293A/ko
Application granted granted Critical
Publication of KR100307465B1 publication Critical patent/KR100307465B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

동일 패키지내에 파워소자칩과 그 구동회로나 제어회로등이 조합되어 있는 파워모듈에 있어서, 파워소자칩을 그 윗면으로 지지하는 방열성을 가지는 금속판으로 구성된 히트스프레더를, 그 윗면에 구동회로나 제어회로 패턴 및 파워소자칩가의 접속패턴이 인쇄된 제어기판의 개구에 삽입하고, 제어기판 및 개구로부터 삽입된 상기 히트스프레더를 베이스 기판에 고정 지지한다. 이렇게 함으로써 파워소자칩과 제어기판을 평면적으로 배치할 수 있고 소형화 할 수 있다.

Description

파워모듈
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 파워모듈 제1실시예의 요부를 나타내는 종단면도이고,
제2도는 그 파워트랜지스터 칩 부분을 제1도와는 다른 방향에서 본 확대 종단면도이며,
제3도는 본 발명의 파워모듈의 제3실시예에 있어서의 파워트랜지스터칩 부분을 나타내는 확대종단면도이다.

Claims (10)

  1. 동일 패키지내에 파워소자칩과 그 구동회로나 제어회로등이 조합되어 있는 파워모듈에 있어서, 상기 파워소자칩을 그 윗면으로 지지하는 방열성을 갖는 금속판으로 구성된 히트스프레더와, 윗면에 상기 구동회로나 제어회로의 패턴 및 상기 파워소자칩과의 접속패턴이 인쇄되고, 상기 히트스프레더가 삽입 가능한 개구를 가지는 제어기판과, 상기 제어기판 및 상기 개구로부터 삽입된 상기 히토스프레더를 고정 지지하는 방열성을 갖는 금속판으로 구성된 베이스기판을 포함하는 것을 특징으로 하는 파워모듈.
  2. 제1항에 있어서, 상기 히트스프레더의 윗면에는 열전도성과 도전성을 갖는 상부 금속부가 마련되어 있고, 상기 금속부와 상기 파워소자칩의 아랫면이 납땜되어 있는 것을 특징으로 하는 파워모듈.
  3. 제1항에 있어서, 상기 히트스프레더의 아랫면에는 열전도성과 도전성을 갖는 하부 금속부가 마련되어 있고, 이 하부 금속부와 상기 베이스기판이 납땜되어 있는 것을 특징으로 하는 파워모듈.
  4. 제1항에 있어서, 상기 히트스프레더의 아랫면이 접착제에 의하여 상기 베이스기판에 고정되어 잇는 것을 특징으로 하는 파워모듈.
  5. 제1항에 있어서, 상기 파워소자칩과 제어기판의 접속패턴과의 사이가 와이어 본딩에 의하여 접속되어 있는 것을 특징으로 하는 파워모듈.
  6. 제1항에 있어서, 상기 파워소자칩은그 윗면에 베이스 및 에미터 전극이 마련되어 있고, 아랫면 전체가 콜렉터 단자로 되어 있으며, 상기 히트스프레더의 윗면은 열전도성과 도전성을 갖는 상부 금속부가 마련되어 있고, 이 금속부와 상기 파워소자칩의 아랫면은 납땜되며, 상기 제어기판의 콜렉터단자용 패턴은 와이어 본딩에 의하여 상기 금속부에 접속되어 있는 것을 특징으로 하는 파워모듈.
  7. 제5항에 있어서, 상기 접속패턴의 윗면은 니켈도금되고 그 위에 금 플래쉬 도금되며, 상기 와이어 본딩용의 와이어가 알루미늄 와이어인 것을 특징으로 하는 파워모듈.
  8. 제1항에 있어서, 상기 파워소자칩의 윗면이 에폭시 수지와 실리카 분말 및 첨가제로 구성된 밀봉제로 덮혀져 있는 것을 특징으로 하는 파워모듈.
  9. 제2항에 있어서, 상기 상부 금속부는 구리의 윗면에 니켈도금이 시행된 DBC로 구성되고, 상기 니켈도금과 상기 파워소자칩의 아랫면이 납땜되어 있는 것을 특징으로 하는 파워모듈.
  10. 제3항에 있어서, 상기 하부 금속부는 구리의 윗면에 니켈도금이 시행된 DBC로 구성되고, 상기 니켈도금과 상기 베이스기판이 납땜되어 있는 것을 특징으로 하는 파워모듈.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930021249A 1992-10-20 1993-10-14 파워모듈 Expired - Fee Related KR100307465B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP92-73068 1992-10-20
JP1992073067U JP2555796Y2 (ja) 1992-10-20 1992-10-20 パワーモジュール
JP92-073069 1992-10-20
JP92-073067 1992-10-20
JP92-73067 1992-10-20
JP92-073068 1992-10-20
JP92-73069 1992-10-20
JP073068U JPH0638248U (ja) 1992-10-20 1992-10-20 パワーモジュール
JP7306992U JPH0638246U (ja) 1992-10-20 1992-10-20 パワーモジュール

Publications (2)

Publication Number Publication Date
KR940010293A true KR940010293A (ko) 1994-05-24
KR100307465B1 KR100307465B1 (ko) 2001-12-15

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Application Number Title Priority Date Filing Date
KR1019930021249A Expired - Fee Related KR100307465B1 (ko) 1992-10-20 1993-10-14 파워모듈

Country Status (5)

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US (1) US5398160A (ko)
EP (1) EP0594395B1 (ko)
KR (1) KR100307465B1 (ko)
CN (1) CN1036043C (ko)
DE (1) DE69325232T2 (ko)

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US5398160A (en) 1995-03-14
CN1086373A (zh) 1994-05-04
EP0594395B1 (en) 1999-06-09
CN1036043C (zh) 1997-10-01
EP0594395A3 (en) 1995-01-11
EP0594395A2 (en) 1994-04-27
DE69325232T2 (de) 2000-02-17
DE69325232D1 (de) 1999-07-15

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